Robert Hoelzl

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Postmuenster, DE

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Patents Grantslast 30 patents

Information Patent Grant
Layered semiconductor wafer with low warp and bow, and process for...
- Patent number 7,820,549
- Issue date Oct 26, 2010
- Siltronic AG
- Markus Blietz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and process for producing it
- Patent number 7,537,657
- Issue date May 26, 2009
- Siltronic AG
- Christoph Seuring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for leveling a semiconductor wafer, and semico...
- Patent number 7,407,891
- Issue date Aug 5, 2008
- Siltronic AG
- Theresia Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Layered Semiconductor Wafer With Low Warp And Bow, And Process For...
- Publication number 20080122043
- Publication date May 29, 2008
- Siltronic AG
- Markus Blietz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon wafer and process for producing it
- Publication number 20060278157
- Publication date Dec 14, 2006
- Siltronic AG
- Christoph Seuring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for leveling a semiconductor wafer, and semico...
- Publication number 20060097355
- Publication date May 11, 2006
- Siltronic AG
- Theresia Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered semiconductor wafer with low warp and bow, and process for...
- Publication number 20060046431
- Publication date Mar 2, 2006
- Siltronic AG
- Markus Blietz
- H01 - BASIC ELECTRIC ELEMENTS