Robert I. Wu

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Portland, OR, US

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Patents Applicationslast 30 patents

Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20060006071
- Publication date Jan 12, 2006
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substantially void free interconnect formation
- Publication number 20050285269
- Publication date Dec 29, 2005
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20040245107
- Publication date Dec 9, 2004
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR