TREA

Robert J. Clarke

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  • East Peckham, GB
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic component, system and method
    • Patent number 10,553,557
    • Issue date Feb 4, 2020
    • Infineon Technologies Austria AG
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of inserting an electronic component into a slot in a circui...
    • Patent number 10,192,846
    • Issue date Jan 29, 2019
    • Infineon Technologies Austria AG
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor package with conductive clips
    • Patent number 9,620,471
    • Issue date Apr 11, 2017
    • Infineon Technologies Americas Corp.
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor package
    • Patent number 9,048,196
    • Issue date Jun 2, 2015
    • International Rectifier Corporation
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Conductive chip-scale package
    • Patent number 8,097,938
    • Issue date Jan 17, 2012
    • International Rectifier Corporation
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip-scale package
    • Patent number 7,524,701
    • Issue date Apr 28, 2009
    • International Rectifier Corporation
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor package
    • Patent number 7,466,012
    • Issue date Dec 16, 2008
    • International Rectifier Corporation
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package fabrication
    • Patent number 7,402,507
    • Issue date Jul 22, 2008
    • International Rectifier Corporation
    • Martin Standing
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Electronic Component, System and Method
    • Publication number 20160126210
    • Publication date May 5, 2016
    • Infineon Technologies Austria AG
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic Component
    • Publication number 20160128198
    • Publication date May 5, 2016
    • Infineon Technologies Austria AG
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power Semiconductor Package with Conductive Clips
    • Publication number 20150262960
    • Publication date Sep 17, 2015
    • INTERNATIONAL RECTIFIER CORPORATION
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP SCALE PACKAGE
    • Publication number 20090174058
    • Publication date Jul 9, 2009
    • International Rectifier Corporation
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power semiconductor package
    • Publication number 20090008804
    • Publication date Jan 8, 2009
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip scale package
    • Publication number 20060240598
    • Publication date Oct 26, 2006
    • International Rectifier Corporation
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package fabrication
    • Publication number 20060205112
    • Publication date Sep 14, 2006
    • Martin Standing
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Power semiconductor package
    • Publication number 20060131760
    • Publication date Jun 22, 2006
    • Martin Standing
    • H01 - BASIC ELECTRIC ELEMENTS