Robert J. Martin

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Salida, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with a stackable package and me...
- Patent number 8,653,654
- Issue date Feb 18, 2014
- Stats Chippac Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity down HBGA package structure
- Patent number 5,910,686
- Issue date Jun 8, 1999
- VLSI Technology, Inc.
- Ahmad Hamzehdoost
- H01 - BASIC ELECTRIC ELEMENTS