Robert J. Teichmann

Person

Belleville, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroformed hollow jewelry
- Patent number 5,891,317
- Issue date Apr 6, 1999
- Avon Products, Inc.
- Robert J. Teichmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multiple layered article having a bright copper layer
- Patent number 5,792,565
- Issue date Aug 11, 1998
- Avon Products, Inc.
- Dennis A. Cupolo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanically compatible conductive filler and methods of making same
- Patent number 5,750,249
- Issue date May 12, 1998
- Potters Industries, Inc.
- James F. Walther
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Galvanically compatible conductive filler useful for electromagneti...
- Patent number 5,286,416
- Issue date Feb 15, 1994
- Potters Industries Inc.
- Robert J. Teichmann
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Galvanically compatible conductive filler
- Patent number 5,175,056
- Issue date Dec 29, 1992
- Potters Industries, Inc.
- Robert J. Teichmann
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Nickel particle plating system
- Patent number 4,857,233
- Issue date Aug 15, 1989
- Potters Industries, Inc.
- Robert J. Teichmann
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Nickel particle plating system
- Patent number 4,711,814
- Issue date Dec 8, 1987
- Robert J. Teichmann
- G11 - INFORMATION STORAGE
Information Patent Grant
Process and composition for the electrodeposition of tin and tin al...
- Patent number 4,381,228
- Issue date Apr 26, 1983
- Occidental Chemical Corporation
- Robert J. Teichmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating tin and tin alloys and baths therefor
- Patent number 4,347,107
- Issue date Aug 31, 1982
- Hooker Chemicals & Plastics Corp.
- Robert J. Teichmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Robert J. Teichmann

Person

Patents Grantslast 30 patents

Electroformed hollow jewelry

Multiple layered article having a bright copper layer

Galvanically compatible conductive filler and methods of making same

Galvanically compatible conductive filler useful for electromagneti...

Galvanically compatible conductive filler

Nickel particle plating system

Nickel particle plating system

Process and composition for the electrodeposition of tin and tin al...

Electroplating tin and tin alloys and baths therefor