Robert J. Walsh

Person

Ballwin, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and process for high temperature wafer edge polishing
- Patent number 6,257,954
- Issue date Jul 10, 2001
- MEMC Electronic Materials, Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for shaping polishing pads
- Patent number 5,840,202
- Issue date Nov 24, 1998
- MEMC Electronic Materials, Inc.
- Robert J. Walsh
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer polishing appartus and method
- Patent number 5,605,487
- Issue date Feb 25, 1997
- MEMC Electric Materials, Inc.
- Harold J. Hileman
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control for wafer polishing
- Patent number 4,450,652
- Issue date May 29, 1984
- Monsanto Company
- Robert J. Walsh
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for wax mounting of thin wafers for polishing
- Patent number 4,316,757
- Issue date Feb 23, 1982
- Monsanto Company
- Robert J. Walsh
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for improving flatness of polished wafers
- Patent number 4,313,284
- Issue date Feb 2, 1982
- Monsanto Company
- Robert J. Walsh
- B24 - GRINDING POLISHING
Information Patent Grant
Process for chemical-mechanical polishing of III-V semiconductor ma...
- Patent number 3,979,239
- Issue date Sep 7, 1976
- Monsanto Company
- Robert J. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing semiconductor wafers
- Patent number 3,964,957
- Issue date Jun 22, 1976
- Monsanto Company
- Robert J. Walsh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Robert J. Walsh

Person

Patents Grantslast 30 patents

Apparatus and process for high temperature wafer edge polishing

Apparatus and method for shaping polishing pads

Semiconductor wafer polishing appartus and method

Temperature control for wafer polishing

Method and apparatus for wax mounting of thin wafers for polishing

Apparatus for improving flatness of polished wafers

Process for chemical-mechanical polishing of III-V semiconductor ma...

Apparatus for processing semiconductor wafers