Robert John Furtaw

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Frisco, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Stable gold bump solder connections
- Patent number 7,939,939
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having resin anti-bleed feature
- Patent number 7,183,657
- Issue date Feb 27, 2007
- Texas Instruments Incorporated
- Robert John Furtaw
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stable Gold Bump Solder Connections
- Publication number 20110177686
- Publication date Jul 21, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE GOLD BUMP SOLDER CONNECTIONS
- Publication number 20110108980
- Publication date May 12, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stable Gold Bump Solder Connections
- Publication number 20090091024
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Having Resin Anti-Bleed Feature
- Publication number 20070116862
- Publication date May 24, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Robert John Furtaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having resin anti-bleed feature
- Publication number 20060060985
- Publication date Mar 23, 2006
- Robert John Furtaw
- H01 - BASIC ELECTRIC ELEMENTS