Robert Joseph Engelhardt Jr.

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Broomfield, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Edge interconnects for use with circuit boards and integrated circuits
- Patent number 11,658,432
- Issue date May 23, 2023
- Indiana Integrated Circuits, LLC
- Robert Joseph Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnects for use with circuit boards and integrated circuits
- Patent number 11,224,126
- Issue date Jan 11, 2022
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Three-Dimensional Printed Circuit Substrate Assembly
- Publication number 20220322532
- Publication date Oct 6, 2022
- Indiana Integrated Circuits, LLC
- Jerome David Huener
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Edge Interconnects for Use with Circuit Boards and Integrated Circuits
- Publication number 20210234294
- Publication date Jul 29, 2021
- Indiana Integrated Circuits, LLC
- Robert Joseph Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Interconnects for Use With Circuit Boards and Integrated Circuits
- Publication number 20210051799
- Publication date Feb 18, 2021
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR