Robert Kerprich

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low density polishing pad
- Patent number 10,946,495
- Issue date Mar 16, 2021
- CMC Materials, Inc.
- Ping Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polishing pad having polishing surface with continuous protrusions
- Patent number 10,293,459
- Issue date May 21, 2019
- Cabot Microelectronics Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having polishing surface with continuous protrusions...
- Patent number 10,160,092
- Issue date Dec 25, 2018
- Cabot Microelectronics Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having polishing surface with continuous protrusions
- Patent number 9,649,742
- Issue date May 16, 2017
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Grooved CMP pads
- Patent number 9,375,823
- Issue date Jun 28, 2016
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with homogeneous body having discrete protrusions the...
- Patent number 9,296,085
- Issue date Mar 29, 2016
- NexPlanar Corporation
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with alignment feature
- Patent number 9,249,273
- Issue date Feb 2, 2016
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Grant
Grooved CMP pad
- Patent number 9,180,570
- Issue date Nov 10, 2015
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Grant
Soft polishing pad for polishing a semiconductor substrate
- Patent number 9,156,124
- Issue date Oct 13, 2015
- NexPlanar Corporation
- William Allison
- B24 - GRINDING POLISHING
Information Patent Grant
CMP pad with local area transparency
- Patent number 9,017,140
- Issue date Apr 28, 2015
- NexPlanar Corporation
- William Allison
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with alignment feature
- Patent number 8,968,058
- Issue date Mar 3, 2015
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
- Publication number 20170203409
- Publication date Jul 20, 2017
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
LOW DENSITY POLISHING PAD
- Publication number 20160221145
- Publication date Aug 4, 2016
- Ping Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GROOVED CMP PADS
- Publication number 20160023321
- Publication date Jan 28, 2016
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Application
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
- Publication number 20150343595
- Publication date Dec 3, 2015
- William C. Allison
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLISHING PAD WITH ALIGNMENT FEATURE
- Publication number 20150152236
- Publication date Jun 4, 2015
- Robert Kerprich
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...
- Publication number 20150056900
- Publication date Feb 26, 2015
- Rajeev Bajaj
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LOW DENSITY POLISHING PAD
- Publication number 20150038066
- Publication date Feb 5, 2015
- NexPlanar Corporation
- Ping Huang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS...
- Publication number 20140273777
- Publication date Sep 18, 2014
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
- Publication number 20140206268
- Publication date Jul 24, 2014
- NexPlanar Corporation
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...
- Publication number 20120302148
- Publication date Nov 29, 2012
- Rajeev Bajaj
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POLISHING PAD WITH ALIGNMENT FEATURE
- Publication number 20120282849
- Publication date Nov 8, 2012
- Robert Kerprich
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
- Publication number 20120009855
- Publication date Jan 12, 2012
- William Allison
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CMP pad with local area transparency
- Publication number 20110171883
- Publication date Jul 14, 2011
- NexPlanar Corporation
- William Allison
- B24 - GRINDING POLISHING
Information Patent Application
Grooved CMP pad
- Publication number 20090311955
- Publication date Dec 17, 2009
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING

Robert Kerprich

Person

Patents Grantslast 30 patents

Low density polishing pad

Polishing pad having polishing surface with continuous protrusions

Polishing pad having polishing surface with continuous protrusions...

Polishing pad having polishing surface with continuous protrusions

Grooved CMP pads

Polishing pad with homogeneous body having discrete protrusions the...

Polishing pad with alignment feature

Grooved CMP pad

Soft polishing pad for polishing a semiconductor substrate

CMP pad with local area transparency

Polishing pad with alignment feature

Patents Applicationslast 30 patents

POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS

LOW DENSITY POLISHING PAD

GROOVED CMP PADS

SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE

POLISHING PAD WITH ALIGNMENT FEATURE

POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...

LOW DENSITY POLISHING PAD

POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS...

POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS

POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THE...

POLISHING PAD WITH ALIGNMENT FEATURE

SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE

CMP pad with local area transparency

Grooved CMP pad