ROBERT L. HUBBARD

Person

Eugene, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of curing thermoplastics with microwave energy
- Patent number 10,854,525
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of curing thermoplastics with microwave energy
- Patent number 10,224,258
- Issue date Mar 5, 2019
- Applied Materials, Inc.
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for microwave processing of photosensitive polyimides
- Patent number 10,139,728
- Issue date Nov 27, 2018
- Applied Materials, Inc.
- Robert L. Hubbard
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for microwave processing of photosensitive polyimides
- Patent number 9,519,221
- Issue date Dec 13, 2016
- Applied Materials, Inc.
- Robert L. Hubbard
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for lower thermal budget multiple cures in semiconductor pac...
- Patent number 9,508,616
- Issue date Nov 29, 2016
- Applied Materials, Inc.
- Iftikhar Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonating conductive traces and methods of using same for bonding...
- Patent number 7,901,536
- Issue date Mar 8, 2011
- Lambda Technologies, Inc.
- Zakaryae Fathi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stacked die package
- Patent number 7,045,390
- Issue date May 16, 2006
- Medtronic, Inc.
- Juan G. Milla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a high-voltage/high-power die package
- Patent number 6,991,961
- Issue date Jan 31, 2006
- Medtronic, Inc.
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stacked device for implantable medical apparatus and...
- Patent number 6,168,973
- Issue date Jan 2, 2001
- Medtronic, Inc.
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stacked device for implantable medical apparatus
- Patent number 6,051,887
- Issue date Apr 18, 2000
- Medtronic, Inc.
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for lower thermal budget multiple cures in semiconductor pac...
- Publication number 20190378713
- Publication date Dec 12, 2019
- Applied Materials, Inc.
- Robert L. Hubbard
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD OF CURING THERMOPLASTICS WITH MICROWAVE ENERGY
- Publication number 20190148252
- Publication date May 16, 2019
- Applied Materials, Inc.
- ROBERT L. HUBBARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MICROWAVE PROCESSING OF PHOTOSENSITIVE POLYIMIDES
- Publication number 20170090284
- Publication date Mar 30, 2017
- Applied Materials, Inc.
- ROBERT L. HUBBARD
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MICROWAVE PROCESSING OF PHOTOSENSITIVE POLYIMIDES
- Publication number 20150198890
- Publication date Jul 16, 2015
- Applied Materials, Inc.
- Robert L. Hubbard
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method of curing thermoplastics with microwave energy
- Publication number 20140284821
- Publication date Sep 25, 2014
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for lower thermal budget multiple cures in semiconductor pac...
- Publication number 20130299953
- Publication date Nov 14, 2013
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for lower thermal budget multiple cures in semiconductor pac...
- Publication number 20130302917
- Publication date Nov 14, 2013
- Iftikhar Ahmad
- B32 - LAYERED PRODUCTS
Information Patent Application
Resonating conductive traces and methods of using same for bonding...
- Publication number 20070284034
- Publication date Dec 13, 2007
- Lambda Technologies, Inc.
- Zakaryae Fathi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for forming a high-voltage/high-power die package
- Publication number 20040259289
- Publication date Dec 23, 2004
- Medtronic, Inc.
- Robert L. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die package
- Publication number 20030180987
- Publication date Sep 25, 2003
- Medtronic, Inc.
- Juan G. Milla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked die package
- Publication number 20020121693
- Publication date Sep 5, 2002
- Juan G. Milla
- H01 - BASIC ELECTRIC ELEMENTS

ROBERT L. HUBBARD

Person

Patents Grantslast 30 patents

Method of curing thermoplastics with microwave energy

Method of curing thermoplastics with microwave energy

Method for microwave processing of photosensitive polyimides

Method for microwave processing of photosensitive polyimides

Method for lower thermal budget multiple cures in semiconductor pac...

Resonating conductive traces and methods of using same for bonding...

Stacked die package

Method of forming a high-voltage/high-power die package

Semiconductor stacked device for implantable medical apparatus and...

Semiconductor stacked device for implantable medical apparatus

Patents Applicationslast 30 patents

Method for lower thermal budget multiple cures in semiconductor pac...

METHOD OF CURING THERMOPLASTICS WITH MICROWAVE ENERGY

METHOD FOR MICROWAVE PROCESSING OF PHOTOSENSITIVE POLYIMIDES

METHOD FOR MICROWAVE PROCESSING OF PHOTOSENSITIVE POLYIMIDES

Method of curing thermoplastics with microwave energy

Method for lower thermal budget multiple cures in semiconductor pac...

Method for lower thermal budget multiple cures in semiconductor pac...

Resonating conductive traces and methods of using same for bonding...

Method for forming a high-voltage/high-power die package

Stacked die package

Stacked die package