Robert Lanzone

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,488,934
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,872,879
- Issue date Dec 22, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,163,867
- Issue date Dec 25, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package fabrication method and structure
- Patent number 9,245,862
- Issue date Jan 26, 2016
- Amkor Technology, Inc.
- Sundeep Nand Nangalia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress substrate and formation method
- Patent number 8,969,192
- Issue date Mar 3, 2015
- Amkor Technology, Inc.
- Robert Lanzone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package fabrication method
- Patent number 8,664,090
- Issue date Mar 4, 2014
- Amkor Technology, Inc.
- Sundeep Nand Nangalia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal tape window frame for heat sink attac...
- Patent number 8,564,114
- Issue date Oct 22, 2013
- Amkor Technology, Inc.
- Robert Lanzone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package fabrication method and structure
- Patent number 8,552,557
- Issue date Oct 8, 2013
- Amkor Technology, Inc.
- Sundeep Nand Nangalia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230118400
- Publication date Apr 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210217725
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180323170
- Publication date Nov 8, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180138155
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR SIDEWALL PROTECTION
- Publication number 20150340332
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SANDWICH EMBEDDED PACKAGE
- Publication number 20150221570
- Publication date Aug 6, 2015
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS

Robert Lanzone

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Copper pillar sidewall protection

Electronic component package fabrication method and structure

Low stress substrate and formation method

Electronic component package fabrication method

Semiconductor package thermal tape window frame for heat sink attac...

Electronic component package fabrication method and structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

COPPER PILLAR SIDEWALL PROTECTION

THIN SANDWICH EMBEDDED PACKAGE