Robert L.D. Zenner

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Minneapolis, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Low temperature bonding electronic adhesives
- Patent number 8,308,991
- Issue date Nov 13, 2012
- 3M Innovative Properties Company
- Eric G. Larson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solvent assisted burnishing of pre-underfilled solder bumped wafers...
- Patent number 7,170,185
- Issue date Jan 30, 2007
- 3M Innovative Properties Company
- Peter B. Hogerton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electronic package
- Patent number 6,246,010
- Issue date Jun 12, 2001
- 3M Innovative Properties Company
- Robert L. D. Zenner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE ADHESIVE PRECURSOR, METHOD OF USING THE SAME, AND ARTICLE
- Publication number 20090155597
- Publication date Jun 18, 2009
- 3M Innovative Properties Company
- Michael A. Kropp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW TEMPERATURE BONDING ELECTRONIC ADHESIVES
- Publication number 20090087591
- Publication date Apr 2, 2009
- Eric G. Larson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV B-STAGEABLE, MOISTURE CURABLE COMPOSITION USEFUL FOR RAPID ELECT...
- Publication number 20070219285
- Publication date Sep 20, 2007
- 3M Innovative Properties Company
- Michael A. Kropp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers...
- Publication number 20070102827
- Publication date May 10, 2007
- 3M Innovative Properties Company
- Peter B. Hogerton
- H01 - BASIC ELECTRIC ELEMENTS