Robert Leon SANKMAN

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 12,300,620
- Issue date May 13, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,261,124
- Issue date Mar 25, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,224,245
- Issue date Feb 11, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 12,206,410
- Issue date Jan 21, 2025
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB patch on glass laminate substrate
- Patent number 12,148,703
- Issue date Nov 19, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core patch with in situ fabricated fan-out layer to enable di...
- Patent number 11,978,685
- Issue date May 7, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on active silicon semiconductor packages
- Patent number 11,978,727
- Issue date May 7, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrates
- Patent number 11,923,257
- Issue date Mar 5, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics assembly including top and bottom packages in stac...
- Patent number 11,915,996
- Issue date Feb 27, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 11,901,248
- Issue date Feb 13, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
- Patent number 11,901,299
- Issue date Feb 13, 2024
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed semiconductor die and package architecture
- Patent number 11,894,359
- Issue date Feb 6, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable high speed high bandwidth IO signaling package architectur...
- Patent number 11,869,842
- Issue date Jan 9, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,870,163
- Issue date Jan 9, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 11,824,018
- Issue date Nov 21, 2023
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,817,444
- Issue date Nov 14, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 11,798,887
- Issue date Oct 24, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 11,764,158
- Issue date Sep 19, 2023
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
- Patent number 11,756,889
- Issue date Sep 12, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,756,860
- Issue date Sep 12, 2023
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 11,735,533
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20250029929
- Publication date Jan 23, 2025
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DI...
- Publication number 20240234225
- Publication date Jul 11, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20240234245
- Publication date Jul 11, 2024
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
- Publication number 20240145395
- Publication date May 2, 2024
- Intel Corporation
- MD Altaf HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
- Publication number 20240128138
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
- Publication number 20240128205
- Publication date Apr 18, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
- Publication number 20240088047
- Publication date Mar 14, 2024
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20240063544
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
- Publication number 20240038687
- Publication date Feb 1, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20240030116
- Publication date Jan 25, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES
- Publication number 20230420375
- Publication date Dec 28, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...
- Publication number 20230420400
- Publication date Dec 28, 2023
- Intel Corporation
- Pramod MALATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...
- Publication number 20230420358
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil S. Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20230260914
- Publication date Aug 17, 2023
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMIB PATCH ON GLASS LAMINATE SUBSTRATE
- Publication number 20230253332
- Publication date Aug 10, 2023
- Intel Corporation
- Robert SANKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE LOGIC DEVICE WITH FINE-GRAINED DISAGGREGATION
- Publication number 20230198526
- Publication date Jun 22, 2023
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC INDUCTOR AND METHOD
- Publication number 20230162902
- Publication date May 25, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20230138543
- Publication date May 4, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20230140685
- Publication date May 4, 2023
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
- Publication number 20230134049
- Publication date May 4, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
- Publication number 20230107106
- Publication date Apr 6, 2023
- Intel Corporation
- MD Altaf HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20220344247
- Publication date Oct 27, 2022
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS...
- Publication number 20220336229
- Publication date Oct 20, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220293327
- Publication date Sep 15, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
5G mmWAVE COOLING THROUGH PCB
- Publication number 20220256715
- Publication date Aug 11, 2022
- Intel Corporation
- Divya MANI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKED DIE CAVITY PACKAGE
- Publication number 20220238402
- Publication date Jul 28, 2022
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20220230965
- Publication date Jul 21, 2022
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS

Robert Leon SANKMAN

Person

Patents Grantslast 30 patents

Inorganic-based embedded-die layers for modular semiconductive devices

Heterogeneous nested interposer package for IC chips

Embedded die architecture and method of making

Embedded die architecture and method of making

Programmable logic device with fine-grained disaggregation

Heterogeneous nested interposer package for IC chips

Multi-chip packaging

EMIB patch on glass laminate substrate

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Microelectronic device with embedded die substrate on interposer

High performance integrated RF passives using dual lithography process

Glass core patch with in situ fabricated fan-out layer to enable di...

Semiconductor device stack-up with bulk substrate material to mitig...

Package on active silicon semiconductor packages

Hybrid microelectronic substrates

Microelectronics assembly including top and bottom packages in stac...

Embedded die architecture and method of making

Interconnect architecture with silicon interposer and EMIB

Distributed semiconductor die and package architecture

Microelectronic device with embedded die substrate on interposer

Scalable high speed high bandwidth IO signaling package architectur...

Antenna package using ball attach array to connect antenna and base...

Full package vapor chamber with IHS

Heterogeneous nested interposer package for IC chips

Multi-chip packaging

Inorganic-based embedded-die layers for modular semiconductive devices

Embedded multi-die interconnect bridge packages with lithographical...

Ultrathin bridge and multi-die ultrafine pitch patch architecture a...

Semiconductor device stack-up with bulk substrate material to mitig...

Heterogeneous nested interposer package for IC chips

Patents Applicationslast 30 patents

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DI...

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB

EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

MULTI-CHIP PACKAGING

SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES

PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...

INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

EMIB PATCH ON GLASS LAMINATE SUBSTRATE

PROGRAMMABLE LOGIC DEVICE WITH FINE-GRAINED DISAGGREGATION

STACKED MAGNETIC INDUCTOR AND METHOD

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS...

CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

5G mmWAVE COOLING THROUGH PCB

STACKED DIE CAVITY PACKAGE

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER