Robert M. Geffken

Person

Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming capping structures on one or more material layer...
- Patent number 7,838,423
- Issue date Nov 23, 2010
- TEL Epion Inc.
- Arthur J. Learn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper interconnect wiring and method and apparatus for forming the...
- Patent number 7,799,683
- Issue date Sep 21, 2010
- TEL Epion, Inc.
- Arthur J. Learn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual damascene integration structure and method for forming improve...
- Patent number 7,759,251
- Issue date Jul 20, 2010
- Tel Epion Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer in single and dual damascene processing
- Patent number 7,655,547
- Issue date Feb 2, 2010
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial metal spacer damascene process
- Patent number 7,393,777
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer in single and dual damascence processing
- Patent number 7,381,637
- Issue date Jun 3, 2008
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable self-aligned air gap dielectric for low capacitance wiring
- Patent number 7,358,148
- Issue date Apr 15, 2008
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect wiring and method of forming thereof
- Patent number 7,291,558
- Issue date Nov 6, 2007
- TEL Epion Inc.
- Robert M. Geffken
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adjustable self-aligned air gap dielectric for low capacitance wiring
- Patent number 7,071,532
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multilevel rework
- Patent number 6,982,227
- Issue date Jan 3, 2006
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact capping local interconnect
- Patent number 6,939,791
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer in single and dual damascene processing
- Patent number 6,888,251
- Issue date May 3, 2005
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial metal spacer damascene process
- Patent number 6,846,741
- Issue date Jan 25, 2005
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-fuse blow corrosion prevention structure for copper fuses
- Patent number 6,746,947
- Issue date Jun 8, 2004
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact capping local interconnect
- Patent number 6,680,514
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multilevel rework
- Patent number 6,674,168
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high-performance decoupling capacitor and heat sink
- Patent number 6,548,338
- Issue date Apr 15, 2003
- International Business Machines Corp.
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing planarization defects
- Patent number 6,503,827
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Susan G. Bombardier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-fuse blow corrosion prevention structure for copper fuses
- Patent number 6,498,385
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of column interconnect
- Patent number 6,495,917
- Issue date Dec 17, 2002
- International Business Machines Corporation
- John J. Ellis-Monaghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene metal capacitor
- Patent number 6,452,251
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal dual damascene plate capacitor
- Patent number 6,426,249
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgy for semiconductor devices
- Patent number 6,426,558
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Jonathan Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling extrusions in aluminum metal lines and the d...
- Patent number 6,420,263
- Issue date Jul 16, 2002
- International Business Machines Corporation
- Roger W. Cheek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Antifuse structure and process
- Patent number 6,344,373
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Arup Bhattacharyya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper stud structure with refractory metal liner
- Patent number 6,300,236
- Issue date Oct 9, 2001
- International Business Machines Corporation
- James M. E. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high-performance decoupling capacitor and heat sink
- Patent number 6,236,103
- Issue date May 22, 2001
- International Business Machines Corp.
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment targets having enhanced contrast
- Patent number 6,180,498
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Robert Michael Geffken
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Copper stud structure with refractory metal liner
- Patent number 6,150,723
- Issue date Nov 21, 2000
- International Business Machines Corporation
- James M. E. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor personalization structure and method
- Patent number 6,093,630
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Robert Michael Geffken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING CAPPING STRUCTURES ON ONE OR MORE MATERIAL LAYER...
- Publication number 20090186482
- Publication date Jul 23, 2009
- TEL Epion Inc.
- Arthur J. Learn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL SPACER IN SINGLE AND DUAL DAMASCENE PROCESSING
- Publication number 20080293242
- Publication date Nov 27, 2008
- International Business Machiness Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL METAL SPACER DUAL DAMASCENE
- Publication number 20080203579
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL
- Publication number 20070275565
- Publication date Nov 29, 2007
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GCIB Cluster Tool Apparatus and Method of Operation
- Publication number 20070184656
- Publication date Aug 9, 2007
- TEL Epion Inc.
- Steven R. Sherman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Interconnect Wiring and Method and Apparatus for Forming The...
- Publication number 20070184655
- Publication date Aug 9, 2007
- TEL Epion Inc.
- Arthur J. Learn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adjustable self-aligned air gap dielectric for low capacitance wiring
- Publication number 20060202302
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect wiring and method of forming thereof
- Publication number 20060105570
- Publication date May 18, 2006
- Epion Corporation
- John J. Hautala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dual damascene integration structure and method for forming improve...
- Publication number 20050272265
- Publication date Dec 8, 2005
- Epion Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal spacer in single and dual damascene processing
- Publication number 20050146040
- Publication date Jul 7, 2005
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial metal spacer damascene process
- Publication number 20050085064
- Publication date Apr 21, 2005
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE SELF-ALIGNED AIR GAP DIELECTRIC FOR LOW CAPACITANCE WIRING
- Publication number 20050067673
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL
- Publication number 20040245636
- Publication date Dec 9, 2004
- International Business Machines Corporation
- Edward C Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial metal liner for copper
- Publication number 20040152295
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Metal Liner For Copper
- Publication number 20040150103
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single and multilevel rework
- Publication number 20040142565
- Publication date Jul 22, 2004
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact capping local interconnect
- Publication number 20040021226
- Publication date Feb 5, 2004
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial metal spacer damascene process
- Publication number 20040018714
- Publication date Jan 29, 2004
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal spacer in single and dual damascene processing
- Publication number 20040000721
- Publication date Jan 1, 2004
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-fuse blow corrosion prevention structure for copper fuses
- Publication number 20030116820
- Publication date Jun 26, 2003
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated high-performance decoupling capacitor and heat sink
- Publication number 20010050408
- Publication date Dec 13, 2001
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS

Robert M. Geffken

Person

Patents Grantslast 30 patents

Method of forming capping structures on one or more material layer...

Copper interconnect wiring and method and apparatus for forming the...

Dual damascene integration structure and method for forming improve...

Metal spacer in single and dual damascene processing

Sacrificial metal spacer damascene process

Metal spacer in single and dual damascence processing

Adjustable self-aligned air gap dielectric for low capacitance wiring

Copper interconnect wiring and method of forming thereof

Adjustable self-aligned air gap dielectric for low capacitance wiring

Single and multilevel rework

Contact capping local interconnect

Metal spacer in single and dual damascene processing

Sacrificial metal spacer damascene process

Post-fuse blow corrosion prevention structure for copper fuses

Contact capping local interconnect

Single and multilevel rework

Integrated high-performance decoupling capacitor and heat sink

Method of reducing planarization defects

Post-fuse blow corrosion prevention structure for copper fuses

Method and structure of column interconnect

Damascene metal capacitor

Buried metal dual damascene plate capacitor

Metallurgy for semiconductor devices

Method for controlling extrusions in aluminum metal lines and the d...

Antifuse structure and process

Copper stud structure with refractory metal liner

Integrated high-performance decoupling capacitor and heat sink

Alignment targets having enhanced contrast

Copper stud structure with refractory metal liner

Semi-conductor personalization structure and method

Patents Applicationslast 30 patents

METHOD OF FORMING CAPPING STRUCTURES ON ONE OR MORE MATERIAL LAYER...

METAL SPACER IN SINGLE AND DUAL DAMASCENE PROCESSING

SACRIFICIAL METAL SPACER DUAL DAMASCENE

FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL

GCIB Cluster Tool Apparatus and Method of Operation

Copper Interconnect Wiring and Method and Apparatus for Forming The...

Adjustable self-aligned air gap dielectric for low capacitance wiring

Copper interconnect wiring and method of forming thereof

Dual damascene integration structure and method for forming improve...

Metal spacer in single and dual damascene processing

Sacrificial metal spacer damascene process

ADJUSTABLE SELF-ALIGNED AIR GAP DIELECTRIC FOR LOW CAPACITANCE WIRING

FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL

Sacrificial metal liner for copper

Sacrificial Metal Liner For Copper

Single and multilevel rework

Contact capping local interconnect

Sacrificial metal spacer damascene process

Metal spacer in single and dual damascene processing

Post-fuse blow corrosion prevention structure for copper fuses

Integrated high-performance decoupling capacitor and heat sink