Robert M. Japp

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making halogen-free circuitized substrate with reduced th...
- Patent number 8,499,440
- Issue date Aug 6, 2013
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with dielectric layer having dielectric compo...
- Patent number 8,445,094
- Issue date May 21, 2013
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered circuitized substrate with P-aramid dielectric layers...
- Patent number 8,211,790
- Issue date Jul 3, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power core for use in circuitized substrate and method of making same
- Patent number 8,198,551
- Issue date Jun 12, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with continuous thermoplastic support film di...
- Patent number 8,084,863
- Issue date Dec 27, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric composition for use in circuitized substrates and circui...
- Patent number 7,931,830
- Issue date Apr 26, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free circuitized substrate with reduced thermal expansion,...
- Patent number 7,687,722
- Issue date Mar 30, 2010
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered circuitized substrate with p-aramid dielectric layers...
- Patent number 7,646,098
- Issue date Jan 12, 2010
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing a printed circuit board with an edge connection...
- Patent number 7,596,863
- Issue date Oct 6, 2009
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system including a circuitized substrate havin...
- Patent number 7,508,076
- Issue date Mar 24, 2009
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low moisture absorptive circuitized substrate with reduced thermal...
- Patent number 7,470,990
- Issue date Dec 30, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluoropolymer dielectric composition for use in circuitized substra...
- Patent number 7,429,789
- Issue date Sep 30, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making same low moisture absorptive circuitized substrave...
- Patent number 7,416,972
- Issue date Aug 26, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,416,996
- Issue date Aug 26, 2008
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,381,587
- Issue date Jun 3, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drill stack formation
- Patent number 7,329,446
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Robert M. Japp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric composition for forming dielectric layer for use in circ...
- Patent number 7,270,845
- Issue date Sep 18, 2007
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite laminate circuit structure
- Patent number 7,259,333
- Issue date Aug 21, 2007
- International Business Machines Corporation
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate
- Patent number 7,078,816
- Issue date Jul 18, 2006
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV absorbing glass cloth and use thereof
- Patent number 7,070,909
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Robert M. Japp
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Formation of multisegmented plated through holes
- Patent number 6,996,903
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for small pitch z-axis electrical interconnect...
- Patent number 6,955,849
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous power and ground planes for reduced PCB delamination and bet...
- Patent number 6,944,946
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
- Patent number 6,841,026
- Issue date Jan 11, 2005
- International Business Machines Corporation
- Lawrence Robert Blumberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV absorbing glass cloth and use thereof
- Patent number 6,838,400
- Issue date Jan 4, 2005
- International Business Machines Corporation
- Robert Maynard Japp
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of fabricating a laminate circuit structure
- Patent number 6,834,426
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate circuit structure and method of fabricating
- Patent number 6,820,332
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for small pitch z-axis electrical interconnect...
- Patent number 6,790,305
- Issue date Sep 14, 2004
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition with a polymerizing agent and method of manufactu...
- Patent number 6,734,259
- Issue date May 11, 2004
- International Business Machines Corporation
- Robert M. Japp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
- Publication number 20120012553
- Publication date Jan 19, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
- Publication number 20110284273
- Publication date Nov 24, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Halogen-Free Dielectric Composition For use As Dielectric Layer In...
- Publication number 20110207866
- Publication date Aug 25, 2011
- Robert M. Japp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuitized substrate with P-aramid dielectric layers and method of...
- Publication number 20090258161
- Publication date Oct 15, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Halogen-free circuitized substrate with reduced thermal expansion,...
- Publication number 20090175000
- Publication date Jul 9, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered circuitized substrate with p-aramid dielectric layers...
- Publication number 20090173426
- Publication date Jul 9, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered circuitized substrate with p-aramid dielectric layers...
- Publication number 20080191353
- Publication date Aug 14, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with p-aramid dielectric layers and method of...
- Publication number 20080191354
- Publication date Aug 14, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of providing a printed circuit board with an edge connection...
- Publication number 20080168651
- Publication date Jul 17, 2008
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Halogen-free circuitized substrate with reduced thermal expansion,...
- Publication number 20080078570
- Publication date Apr 3, 2008
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRILL STACK FORMATION
- Publication number 20080032155
- Publication date Feb 7, 2008
- Robert M. Japp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with dielectric layer having dielectric compo...
- Publication number 20080003407
- Publication date Jan 3, 2008
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making same low moisture absorptive circuitized substrave...
- Publication number 20070182016
- Publication date Aug 9, 2007
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrate
- Publication number 20070166944
- Publication date Jul 19, 2007
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluoropolymer dielectric composition for use in circuitized substra...
- Publication number 20060180936
- Publication date Aug 17, 2006
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrate
- Publication number 20060131755
- Publication date Jun 22, 2006
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Information handling system
- Publication number 20060125103
- Publication date Jun 15, 2006
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric composition for use in circuitized substrates and circui...
- Publication number 20060054870
- Publication date Mar 16, 2006
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric composition for forming dielectric layer for use in circ...
- Publication number 20050224767
- Publication date Oct 13, 2005
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate, method of making same, electrical assembly u...
- Publication number 20050224985
- Publication date Oct 13, 2005
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low moisture absorptive circuitized substrate with reduced thermal...
- Publication number 20050218524
- Publication date Oct 6, 2005
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Formation of multisegmented plated through holes
- Publication number 20050079289
- Publication date Apr 14, 2005
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LAMINATE CIRCUIT STRUCTURE
- Publication number 20050048408
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV absorbing glass cloth and use thereof
- Publication number 20050026051
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Robert Maynard Japp
- D03 - WEAVING
Information Patent Application
Method and structure for small pitch z-axis electrical interconnect...
- Publication number 20050008833
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Drill stack formation
- Publication number 20040086741
- Publication date May 6, 2004
- Robert M. Japp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION WITH A POLYMERIZING AGENT AND METHOD OF MANUFACTU...
- Publication number 20040082730
- Publication date Apr 29, 2004
- International Business Machines Corporation
- Robert M. Japp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and structure for small pitch z-axis electrical interconnect...
- Publication number 20040067347
- Publication date Apr 8, 2004
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Porous power and ground planes for reduced PCB delamination and bet...
- Publication number 20030196749
- Publication date Oct 23, 2003
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate circuit structure and method of fabricating
- Publication number 20030042046
- Publication date Mar 6, 2003
- International Business Machines Corporation
- Robert M. Japp
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Robert M. Japp

Person

Patents Grantslast 30 patents

Method of making halogen-free circuitized substrate with reduced th...

Circuitized substrate with dielectric layer having dielectric compo...

Multilayered circuitized substrate with P-aramid dielectric layers...

Power core for use in circuitized substrate and method of making same

Circuitized substrate with continuous thermoplastic support film di...

Dielectric composition for use in circuitized substrates and circui...

Halogen-free circuitized substrate with reduced thermal expansion,...

Multilayered circuitized substrate with p-aramid dielectric layers...

Method of providing a printed circuit board with an edge connection...

Information handling system including a circuitized substrate havin...

Low moisture absorptive circuitized substrate with reduced thermal...

Fluoropolymer dielectric composition for use in circuitized substra...

Method of making same low moisture absorptive circuitized substrave...

Method of making circuitized substrate

Method of making circuitized substrate

Drill stack formation

Dielectric composition for forming dielectric layer for use in circ...

Composite laminate circuit structure

Circuitized substrate

UV absorbing glass cloth and use thereof

Formation of multisegmented plated through holes

Method and structure for small pitch z-axis electrical interconnect...

Porous power and ground planes for reduced PCB delamination and bet...

Method for reducing coefficient of thermal expansion in chip attach...

UV absorbing glass cloth and use thereof

Method of fabricating a laminate circuit structure

Method of making a multi-layered interconnect structure

Laminate circuit structure and method of fabricating

Method and structure for small pitch z-axis electrical interconnect...

Resin composition with a polymerizing agent and method of manufactu...

Patents Applicationslast 30 patents

METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES

POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME

Halogen-Free Dielectric Composition For use As Dielectric Layer In...

Circuitized substrate with P-aramid dielectric layers and method of...

Halogen-free circuitized substrate with reduced thermal expansion,...

Multilayered circuitized substrate with p-aramid dielectric layers...

Multilayered circuitized substrate with p-aramid dielectric layers...

Circuitized substrate with p-aramid dielectric layers and method of...

Method of providing a printed circuit board with an edge connection...

Halogen-free circuitized substrate with reduced thermal expansion,...

DRILL STACK FORMATION

Circuitized substrate with dielectric layer having dielectric compo...

Method of making same low moisture absorptive circuitized substrave...

Method of making circuitized substrate

Fluoropolymer dielectric composition for use in circuitized substra...

Method of making circuitized substrate

Information handling system

Dielectric composition for use in circuitized substrates and circui...

Dielectric composition for forming dielectric layer for use in circ...

Circuitized substrate, method of making same, electrical assembly u...

Low moisture absorptive circuitized substrate with reduced thermal...

Formation of multisegmented plated through holes

COMPOSITE LAMINATE CIRCUIT STRUCTURE

UV absorbing glass cloth and use thereof

Method and structure for small pitch z-axis electrical interconnect...

Drill stack formation

RESIN COMPOSITION WITH A POLYMERIZING AGENT AND METHOD OF MANUFACTU...

Method and structure for small pitch z-axis electrical interconnect...

Porous power and ground planes for reduced PCB delamination and bet...

Laminate circuit structure and method of fabricating