Robert P. Sheppard

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Redbluff, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an enhanced thermal dissipation integrated...
- Patent number 7,015,072
- Issue date Mar 21, 2006
- ASAT Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal dissipation integrated circuit package
- Patent number 6,734,552
- Issue date May 11, 2004
- ASAT Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a flexible integrated circuit package utili...
- Patent number 6,284,569
- Issue date Sep 4, 2001
- ASAT, Limited
- Robert P. Sheppard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with bonding planes on a ceramic ring us...
- Patent number 6,285,075
- Issue date Sep 4, 2001
- ASAT, Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated carrier ring/stiffener and method for manufacturing a fl...
- Patent number 6,111,324
- Issue date Aug 29, 2000
- Asat, Limited
- Robert P. Sheppard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing enhanced thermal dissipation integrated cir...
- Publication number 20060223237
- Publication date Oct 5, 2006
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an enhanced thermal dissipation integrated...
- Publication number 20050003585
- Publication date Jan 6, 2005
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced thermal dissipation integrated circuit package and method...
- Publication number 20030011064
- Publication date Jan 16, 2003
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Saw-singulated leadless plastic chip carrier
- Publication number 20010030355
- Publication date Oct 18, 2001
- Neil Mclellan
- H01 - BASIC ELECTRIC ELEMENTS