Robert RUETHER

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Lehnitz, DE

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Patents Grantslast 30 patents

Information Patent Grant
Solution and process for increasing the solderability and corrosion...
- Patent number 8,491,713
- Issue date Jul 23, 2013
- Atotech Deutschland GmbH
- Jürgen Barthelmes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ni-P layer system and process for its preparation
- Patent number 8,304,658
- Issue date Nov 6, 2012
- Atotech Deutschland GmbH
- Juergen Barthelmes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONT...
- Publication number 20170159195
- Publication date Jun 8, 2017
- Atotech Deutschland GmbH
- Jana BREITFELDER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS
- Publication number 20160060781
- Publication date Mar 3, 2016
- Atotech Deutschland GmbH
- Markus GLOEDEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION...
- Publication number 20110281124
- Publication date Nov 17, 2011
- Jürgen Barthelmes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NI-P LAYER SYSTEM AND PROCESS FOR ITS PREPARATION
- Publication number 20100326713
- Publication date Dec 30, 2010
- Atotech Deutschland GmbH
- Juergen Barthelmes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR