Robert T. Trabucco

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for planarizing an array of solder balls
- Patent number 6,088,914
- Issue date Jul 18, 2000
- LSI Logic Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for compensating for bottom warpage of a BGA integrated circuit
- Patent number 5,989,937
- Issue date Nov 23, 1999
- LSI Logic Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for planarizing an array of solder balls
- Patent number 5,901,437
- Issue date May 11, 1999
- LSI Logic Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless solder ball attachment process
- Patent number 5,899,737
- Issue date May 4, 1999
- LSI Logic Corporation
- Robert T. Trabucco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer ball attachment for grid array semiconductor pac...
- Patent number 5,761,048
- Issue date Jun 2, 1998
- LSI Logic Corp.
- Robert T. Trabucco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing an array of plastically deformable contacts o...
- Patent number 5,745,986
- Issue date May 5, 1998
- LSI Logic Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package fabrication method and apparatus
- Patent number 5,610,442
- Issue date Mar 11, 1997
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for attaching multiple lids to multi-chip module (MCM) inte...
- Patent number 5,465,470
- Issue date Nov 14, 1995
- LSI Logic Corporation
- Sutee Vongfuangfoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a coplanar solder ball contact array
- Patent number 5,435,482
- Issue date Jul 25, 1995
- LSI Logic Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a dissolvable film carrier containing conductive bum...
- Patent number 5,388,327
- Issue date Feb 14, 1995
- LSI Logic Corporation
- Robert T. Trabucco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Casting of raised bump contacts on a substrate
- Patent number 5,381,848
- Issue date Jan 17, 1995
- LSI Logic Corporation
- Robert T. Trabucco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Robert T. Trabucco

Person

Patents Grantslast 30 patents

Method for planarizing an array of solder balls

Method for compensating for bottom warpage of a BGA integrated circuit

Method for planarizing an array of solder balls

Fluxless solder ball attachment process

Conductive polymer ball attachment for grid array semiconductor pac...

Method of planarizing an array of plastically deformable contacts o...

Semiconductor device package fabrication method and apparatus

Fixture for attaching multiple lids to multi-chip module (MCM) inte...

Integrated circuit having a coplanar solder ball contact array

Fabrication of a dissolvable film carrier containing conductive bum...

Casting of raised bump contacts on a substrate