Robert W. Helda

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Hollywood, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Contact bonded packaged integrated circuit
- Patent number 4,028,722
- Issue date Jun 7, 1977
- Motorola, Inc.
- Robert W. Helda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device employing metal frame means with preforme...
- Patent number 4,003,073
- Issue date Jan 11, 1977
- Motorola, Inc.
- Robert W. Helda
- H01 - BASIC ELECTRIC ELEMENTS