Robert W. Rumsey

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-scale package conversion technique for dies
- Patent number 7,979,813
- Issue date Jul 12, 2011
- Micrel, Inc.
- Robert Rumsey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Box-in-box field-to-field alignment structure
- Patent number 7,273,761
- Issue date Sep 25, 2007
- Micrel, Inc.
- Robert W. Rumsey
- G01 - MEASURING TESTING
Information Patent Grant
Integrating chip scale packaging metallization into integrated circ...
- Patent number 7,211,893
- Issue date May 1, 2007
- Micrel, Incorporated
- Martin Alter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical field alignment vernier
- Patent number 6,984,531
- Issue date Jan 10, 2006
- Micrel, Inc.
- Robert W. Rumsey
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrating chip scale packaging metallization into integrated circ...
- Patent number 6,900,538
- Issue date May 31, 2005
- Micrel, Inc.
- Martin Alter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Box-in-box field-to-field alignment structure
- Patent number 6,815,128
- Issue date Nov 9, 2004
- Micrel, Inc.
- Robert W. Rumsey
- G01 - MEASURING TESTING
Information Patent Grant
Electrical field alignment vernier
- Patent number 6,762,432
- Issue date Jul 13, 2004
- Micrel, Inc.
- Robert W. Rumsey
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrical print resolution test die
- Patent number 6,762,434
- Issue date Jul 13, 2004
- Micrel, Inc.
- Robert W. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical print resolution test die
- Patent number 6,649,932
- Issue date Nov 18, 2003
- Micrel, Inc.
- Robert W. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip-Scale Package Conversion Technique for Dies
- Publication number 20100180249
- Publication date Jul 15, 2010
- MICREL, INC.
- Robert Rumsey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrating chip scale packaging metallization into integrated circ...
- Publication number 20050062156
- Publication date Mar 24, 2005
- Martin Alter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Box-in-box field-to-field alignment structure
- Publication number 20050042529
- Publication date Feb 24, 2005
- Robert W. Rumsey
- G01 - MEASURING TESTING
Information Patent Application
Integrating chip scale packaging metallization into integrated circ...
- Publication number 20040245633
- Publication date Dec 9, 2004
- Martin Alter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical field alignment vernier
- Publication number 20040219440
- Publication date Nov 4, 2004
- Robert W. Rumsey
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electrical print resolution test die
- Publication number 20030210058
- Publication date Nov 13, 2003
- Robert W. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical field alignment vernier
- Publication number 20030186133
- Publication date Oct 2, 2003
- Robert W. Rumsey
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Box-in-box field-to-field alignment structure
- Publication number 20030186132
- Publication date Oct 2, 2003
- Robert W. Rumsey
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL PRINT RESOLUTION TEST DIE
- Publication number 20030186473
- Publication date Oct 2, 2003
- Robert W. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS

Robert W. Rumsey

Person

Patents Grantslast 30 patents

Chip-scale package conversion technique for dies

Box-in-box field-to-field alignment structure

Integrating chip scale packaging metallization into integrated circ...

Electrical field alignment vernier

Integrating chip scale packaging metallization into integrated circ...

Box-in-box field-to-field alignment structure

Electrical field alignment vernier

Electrical print resolution test die

Electrical print resolution test die

Patents Applicationslast 30 patents

Chip-Scale Package Conversion Technique for Dies

Integrating chip scale packaging metallization into integrated circ...

Box-in-box field-to-field alignment structure

Integrating chip scale packaging metallization into integrated circ...

Electrical field alignment vernier

Electrical print resolution test die

Electrical field alignment vernier

Box-in-box field-to-field alignment structure

ELECTRICAL PRINT RESOLUTION TEST DIE