Robert W. Tait

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Plano, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Densified foam for thermal insulation in electronic devices
- Patent number 10,842,046
- Issue date Nov 17, 2020
- Boyd Corporation
- Richard M. Hartman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Densified foam for thermal insulation in electronic devices
- Patent number 10,448,541
- Issue date Oct 15, 2019
- Richard M. Hartman
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DENSIFIED FOAM FOR THERMAL INSULATION IN ELECTRONIC DEVICES
- Publication number 20200022285
- Publication date Jan 16, 2020
- Boyd Corporation
- Richard M. Hartman
- B32 - LAYERED PRODUCTS
Information Patent Application
DENSIFIED FOAM FOR THERMAL INSULATION IN ELECTRONIC DEVICES
- Publication number 20170150651
- Publication date May 25, 2017
- Boyd Corporation
- Richard M. Hartman
- B32 - LAYERED PRODUCTS