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Robert Weinke
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Munchen, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Producing SiC packs on a wafer plane
Patent number
8,809,180
Issue date
Aug 19, 2014
Siemens Aktiengesellschaft
Karl Weidner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Strip conductor structure for minimizing thermomechanical loads
Patent number
8,415,802
Issue date
Apr 9, 2013
Siemens Aktiengesellschaft
Michael Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and method for producing an electric functional l...
Patent number
8,395,257
Issue date
Mar 12, 2013
Siemens Aktiengesellschaft
Jens-Christian Holst
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for contacting electronic components by means of a substrate...
Patent number
8,261,439
Issue date
Sep 11, 2012
Siemens Aktiengesellschaft
Axel Kaltenbacher
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Contacting multilayer piezo actuators or sensors
Patent number
7,821,184
Issue date
Oct 26, 2010
Siemens Aktiengesellschaft
Michael Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR PRODUCING AN ELECTRIC FUNCTIONAL LAYER ON A SURFACE OF A...
Publication number
20110272826
Publication date
Nov 10, 2011
Jens-Christian Holst
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Strip conductor structure for minimizing thermomechanocal loads
Publication number
20100289152
Publication date
Nov 18, 2010
Michael Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for the Production and Contacting of Electronic Components b...
Publication number
20100208438
Publication date
Aug 19, 2010
Axel Kaltenbacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACTING MULTILAYER PIEZO ACTUATORS OR SENSORS
Publication number
20090179527
Publication date
Jul 16, 2009
Michael Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive Strip Conductor on an Insulating Layer
Publication number
20080191360
Publication date
Aug 14, 2008
Karl Weidner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Strip Conductor Structure for Minimizing Thermomechanical Loads
Publication number
20080164616
Publication date
Jul 10, 2008
Michael Kaspar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Producing SiC Packs on a Wafer Plane
Publication number
20080128710
Publication date
Jun 5, 2008
SIEMENS AKTIENGESELLSCHAFT
Karl Weidner
H01 - BASIC ELECTRIC ELEMENTS