Roberto Coccioli

Person

Westlake Village, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated optical transceiver
- Patent number 12,128,729
- Issue date Oct 29, 2024
- MARVELL ASIA PTE. LTD.
- Ding Liang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device package with semiconductive thermal pedestal
- Patent number 12,021,003
- Issue date Jun 25, 2024
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optical transceiver
- Patent number 11,791,899
- Issue date Oct 17, 2023
- MARVELL ASIA PTE. LTD.
- Ding Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-packaged multi-channel light engine on single substrate
- Patent number 11,777,631
- Issue date Oct 3, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Electro-optic package featuring sputtered EMI shield
- Patent number 11,694,971
- Issue date Jul 4, 2023
- MARVELL ASIA PTE. LTD.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for co-packaging light engine chiplets on switch substrate
- Patent number 11,677,478
- Issue date Jun 13, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 11,612,079
- Issue date Mar 21, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Integrated compact in-package light engine
- Patent number 11,381,313
- Issue date Jul 5, 2022
- MARVELL ASIA PTE. LTD.
- Ding Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-packaged multi-channel light engine on single substrate
- Patent number 11,218,242
- Issue date Jan 4, 2022
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. Nagarajan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Co-packaged light engine chiplets on switch substrate
- Patent number 11,178,473
- Issue date Nov 16, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Method for co-packaging light engine chiplets on switch substrate
- Patent number 11,165,509
- Issue date Nov 2, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. Nagarajan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 11,109,515
- Issue date Aug 31, 2021
- Inphi Corporation
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact optical module integrated for communicating cryptocurrency...
- Patent number 10,924,269
- Issue date Feb 16, 2021
- INPHI CORPORATION
- Liang Ding
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated compact in-package light engine
- Patent number 10,892,830
- Issue date Jan 12, 2021
- INPHI CORPORATION
- Ding Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated compact in-package light engine
- Patent number 10,826,613
- Issue date Nov 3, 2020
- INPHI CORPORATION
- Ding Liang
- G02 - OPTICS
Information Patent Grant
Optical transceiver by FOWLP and DOP multichip integration
- Patent number 10,120,150
- Issue date Nov 6, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Optical transceiver by FOWLP and DoP multichip integration
- Patent number 10,001,611
- Issue date Jun 19, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Compact optical transceiver by hybrid multichip integration
- Patent number 9,921,379
- Issue date Mar 20, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Compact optical transceiver by hybrid multichip integration
- Patent number 9,651,751
- Issue date May 16, 2017
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Method and apparatus for improving the performance of edge launch a...
- Patent number 6,863,548
- Issue date Mar 8, 2005
- Inphi Corporation
- Roberto Coccioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded antenna and semiconductor die on a substrate in a laminate...
- Patent number 6,818,985
- Issue date Nov 16, 2004
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded antenna in a semiconductor package
- Patent number 6,770,955
- Issue date Aug 3, 2004
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for broadband transition from IC package to mothe...
- Patent number 6,700,181
- Issue date Mar 2, 2004
- Inphi Corporation
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabrication of a leadless chip carrier wit...
- Patent number 6,582,979
- Issue date Jun 24, 2003
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin grid array package with controlled impedance pins
- Patent number 6,534,854
- Issue date Mar 18, 2003
- Conexant Systems, Inc.
- Siamak Fazelpour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High inductance inductor in a semiconductor package
- Patent number 6,512,285
- Issue date Jan 28, 2003
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Optical Transceiver
- Publication number 20240149632
- Publication date May 9, 2024
- Marvell Asia Pte Ltd.
- Ding LIANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20230225090
- Publication date Jul 13, 2023
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL
- Publication number 20230051507
- Publication date Feb 16, 2023
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL TRANSCEIVER
- Publication number 20220416900
- Publication date Dec 29, 2022
- Marvell Asia Pte Ltd.
- Ding Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE
- Publication number 20220123852
- Publication date Apr 21, 2022
- Marvell Asia Pte Ltd.
- Radhakrishnan L. NAGARAJAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CO-PACKAGED LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE
- Publication number 20210385560
- Publication date Dec 9, 2021
- INPHI CORPORATION
- Radhakrishnan L. NAGARAJAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR CO-PACKAGING LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE
- Publication number 20210384989
- Publication date Dec 9, 2021
- Marvell Asia Pte, Ltd.
- Radhakrashnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE
- Publication number 20210385000
- Publication date Dec 9, 2021
- INPHI CORPORATION
- Radhakrishnan L. NAGARAJAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20210385975
- Publication date Dec 9, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COMPACT IN-PACKAGE LIGHT ENGINE
- Publication number 20210175973
- Publication date Jun 10, 2021
- INPHI CORPORATION
- Ding LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION
- Publication number 20180275359
- Publication date Sep 27, 2018
- INPHI CORPORATION
- Liang DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT OPTICAL TRANSCEIVER BY HYBRID MULTICHIP INTEGRATION
- Publication number 20170261708
- Publication date Sep 14, 2017
- INPHI CORPORATION
- Liang DING
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION
- Publication number 20170254968
- Publication date Sep 7, 2017
- INPHI CORPORATION
- Liang DING
- G02 - OPTICS
Information Patent Application
Structure and method for fabrication of a leadless chip carrier wit...
- Publication number 20020167084
- Publication date Nov 14, 2002
- Conexant Systems, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS

Roberto Coccioli

Person

Patents Grantslast 30 patents

Integrated optical transceiver

Semiconductor device package with semiconductive thermal pedestal

Integrated optical transceiver

In-packaged multi-channel light engine on single substrate

Electro-optic package featuring sputtered EMI shield

Method for co-packaging light engine chiplets on switch substrate

Heatsink for co-packaged optical switch rack package

Integrated compact in-package light engine

In-packaged multi-channel light engine on single substrate

Co-packaged light engine chiplets on switch substrate

Method for co-packaging light engine chiplets on switch substrate

Heatsink for co-packaged optical switch rack package

Compact optical module integrated for communicating cryptocurrency...

Integrated compact in-package light engine

Integrated compact in-package light engine

Optical transceiver by FOWLP and DOP multichip integration

Optical transceiver by FOWLP and DoP multichip integration

Compact optical transceiver by hybrid multichip integration

Compact optical transceiver by hybrid multichip integration

Method and apparatus for improving the performance of edge launch a...

Embedded antenna and semiconductor die on a substrate in a laminate...

Shielded antenna in a semiconductor package

Method and system for broadband transition from IC package to mothe...

Structure and method for fabrication of a leadless chip carrier wit...

Pin grid array package with controlled impedance pins

High inductance inductor in a semiconductor package

Patents Applicationslast 30 patents

Integrated Optical Transceiver

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL

INTEGRATED OPTICAL TRANSCEIVER

IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE

CO-PACKAGED LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE

METHOD FOR CO-PACKAGING LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE

IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

INTEGRATED COMPACT IN-PACKAGE LIGHT ENGINE

OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION

COMPACT OPTICAL TRANSCEIVER BY HYBRID MULTICHIP INTEGRATION

OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION

Structure and method for fabrication of a leadless chip carrier wit...