Roberto TIZIANI

Person

NERVIANO, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with die mounted to an insulating substrate an...
- Patent number 12,040,263
- Issue date Jul 16, 2024
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,749,588
- Issue date Sep 5, 2023
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,626,379
- Issue date Apr 11, 2023
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor devices, corresponding semiconductor pr...
- Patent number 11,557,547
- Issue date Jan 17, 2023
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a molded MMC multi media card package obta...
- Patent number 7,803,663
- Issue date Sep 28, 2010
- STMicroelectronics, SRL
- Roberto Tiziani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor electronic device and method of manufacturing thereof
- Patent number 7,459,387
- Issue date Dec 2, 2008
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads of a no-lead type package of a semiconductor device
- Patent number 6,909,166
- Issue date Jun 21, 2005
- STMicroelectronics S.r.l.
- Giovanni Frezza
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe for integrated circuit chips having low resistance connec...
- Patent number 6,838,755
- Issue date Jan 4, 2005
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor electronic device and method of manufacturing thereof
- Patent number 6,815,789
- Issue date Nov 9, 2004
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective envelope for a semiconductor integrated circuit
- Patent number 6,593,665
- Issue date Jul 15, 2003
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing molding residues in the fabrication of plastic...
- Patent number 6,468,356
- Issue date Oct 22, 2002
- STMicroelectronics S.r.l.
- Paolo Crema
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power semiconductor device for “flip-chip” connections
- Patent number 6,291,893
- Issue date Sep 18, 2001
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card assembly of power device in plastic package with external heat...
- Patent number 6,195,256
- Issue date Feb 27, 2001
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT MEASUREMENT DEVICE, CORRESPONDING MANUFACTURING METHOD AND...
- Publication number 20240329098
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20240178105
- Publication date May 30, 2024
- STMicroelectronics S.r.l.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20230411258
- Publication date Dec 21, 2023
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230230948
- Publication date Jul 20, 2023
- STMicroelectronics S.r.l.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...
- Publication number 20230135498
- Publication date May 4, 2023
- STMicroelectronics S.r.l.
- Yi Ming LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPON...
- Publication number 20230031356
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20220384209
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20220352057
- Publication date Nov 3, 2022
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE FOR GENERATING LIGHT PULSES FOR LIDAR APPLICATION...
- Publication number 20220214430
- Publication date Jul 7, 2022
- STMicroelectronics S.r.l.
- Romeo LETOR
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...
- Publication number 20220199500
- Publication date Jun 23, 2022
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20220102258
- Publication date Mar 31, 2022
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20210305191
- Publication date Sep 30, 2021
- STMicroelectronics S.r.l.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR PR...
- Publication number 20210193591
- Publication date Jun 24, 2021
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20210183752
- Publication date Jun 17, 2021
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH ELECTRONIC POWER COMPONENT AND DIRECT DETECT...
- Publication number 20170125998
- Publication date May 4, 2017
- MAGNETI MARELLI S.P.A.
- Roberto TIZIANI
- G01 - MEASURING TESTING
Information Patent Application
LIQUID COOLING SYSTEM FOR AN ELECTRONIC COMPONENT
- Publication number 20160105997
- Publication date Apr 14, 2016
- MAGNETI MARELLI S.P.A.
- Roberto TIZIANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a moulded MMC multi media card package obt...
- Publication number 20060057823
- Publication date Mar 16, 2006
- STMicroelectronics S.r.l.
- Roberto Tiziani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor electronic device and method of manufacturing thereof
- Publication number 20050073057
- Publication date Apr 7, 2005
- STMicroelectronics S.r.I.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for power semiconductor electronic devices
- Publication number 20040262721
- Publication date Dec 30, 2004
- STMicroelectronics S.r. I.
- Claudio Deodato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor electronic device and method of manufacturing thereof
- Publication number 20040072396
- Publication date Apr 15, 2004
- STMicroelectronics S.r.I.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for semiconductor device with ground lead connection having...
- Publication number 20030146500
- Publication date Aug 7, 2003
- STMicroelectronics S.r.l.
- Battista Vitali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor electronic device and method of manufacturing thereof
- Publication number 20030127701
- Publication date Jul 10, 2003
- STMicroelectronics S.r. I.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leads of a no-lead type package of a semiconductor device
- Publication number 20030057542
- Publication date Mar 27, 2003
- Giovanni Frezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective envelope for a semiconductor integrated circuit
- Publication number 20020050630
- Publication date May 2, 2002
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe for chips, having low resistance connections
- Publication number 20020043701
- Publication date Apr 18, 2002
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING MOLDING RESIDUES IN THE FABRICATION OF PLASTIC...
- Publication number 20010008139
- Publication date Jul 19, 2001
- PAOLO CREMA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Roberto TIZIANI

Person

Patents Grantslast 30 patents

Semiconductor device with die mounted to an insulating substrate an...

Semiconductor device and corresponding method

Method of manufacturing semiconductor devices and corresponding sem...

Leadframe for semiconductor devices, corresponding semiconductor pr...

Method for manufacturing a molded MMC multi media card package obta...

Semiconductor electronic device and method of manufacturing thereof

Leads of a no-lead type package of a semiconductor device

Leadframe for integrated circuit chips having low resistance connec...

Semiconductor electronic device and method of manufacturing thereof

Protective envelope for a semiconductor integrated circuit

Method for removing molding residues in the fabrication of plastic...

Power semiconductor device for &#x0201C;flip-chip&#x0201D; connections

Card assembly of power device in plastic package with external heat...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

CURRENT MEASUREMENT DEVICE, CORRESPONDING MANUFACTURING METHOD AND...

METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...

METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

ELECTRONIC MODULE FOR GENERATING LIGHT PULSES FOR LIDAR APPLICATION...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

LEADFRAME FOR SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR PR...

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

ELECTRONIC DEVICE WITH ELECTRONIC POWER COMPONENT AND DIRECT DETECT...

LIQUID COOLING SYSTEM FOR AN ELECTRONIC COMPONENT

Method for manufacturing a moulded MMC multi media card package obt...

Semiconductor electronic device and method of manufacturing thereof

Manufacturing method for power semiconductor electronic devices

Semiconductor electronic device and method of manufacturing thereof

Package for semiconductor device with ground lead connection having...

Semiconductor electronic device and method of manufacturing thereof

Leads of a no-lead type package of a semiconductor device

Protective envelope for a semiconductor integrated circuit

Leadframe for chips, having low resistance connections

METHOD FOR REMOVING MOLDING RESIDUES IN THE FABRICATION OF PLASTIC...

Power semiconductor device for “flip-chip” connections