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Robinson Quiazon
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor flip chip package having substantially non-collapsibl...
Patent number
8,405,230
Issue date
Mar 26, 2013
Stats Chippac Ltd.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor flip chip package having substantially non-collapsibl...
Patent number
7,880,313
Issue date
Feb 1, 2011
ChipPAC, Inc.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit encapsulation system with vent
Patent number
7,482,683
Issue date
Jan 27, 2009
Stats Chippac Ltd.
Antonio B. Dimaano, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with downset lead
Patent number
7,443,015
Issue date
Oct 28, 2008
Stats Chippac Ltd.
Jeffrey D. Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etched leadframe flipchip package system
Patent number
7,414,318
Issue date
Aug 19, 2008
Stats Chippac Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etched leadframe flipchip package system
Patent number
7,250,685
Issue date
Jul 31, 2007
Stats Chippac Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBL...
Publication number
20110108970
Publication date
May 12, 2011
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT ENCAPSULATION SYSTEM WITH VENT
Publication number
20070262423
Publication date
Nov 15, 2007
STATS ChipPAC Ltd.
Antonio B. Dimaano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM
Publication number
20070241432
Publication date
Oct 18, 2007
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DOWNSET LEAD
Publication number
20070108624
Publication date
May 17, 2007
STATS ChipPAC Ltd.
Jeffrey D. Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM
Publication number
20070108565
Publication date
May 17, 2007
STATS ChipPAC Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package flip chip interconnect having spacer
Publication number
20060192295
Publication date
Aug 31, 2006
ChipPAC, Inc.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS