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Roc Blumenthal
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Austin, TX, US
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last 30 patents
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Patent Grant
Method for forming a via in a semiconductor device
Patent number
5,702,981
Issue date
Dec 30, 1997
Papu D. Maniar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Process for fabricating a metallized interconnect structure in a se...
Patent number
5,633,199
Issue date
May 27, 1997
Motorola Inc.
Robert W. Fiordalice
H01 - BASIC ELECTRIC ELEMENTS