Rod Kistler

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for chemical mechanical planarization
- Patent number 7,033,250
- Issue date Apr 25, 2006
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Methods using active retainer rings for improving edge performance...
- Patent number 6,913,521
- Issue date Jul 5, 2005
- Lam Research Corporation
- Alek Owczarz
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for polishing and planarizing semiconductor wafer...
- Patent number 6,869,337
- Issue date Mar 22, 2005
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for removal/remaining thickness profile manipulation
- Patent number 6,808,442
- Issue date Oct 26, 2004
- Lam Research Corporation
- David Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Platen design for improving edge performance in CMP applications
- Patent number 6,776,695
- Issue date Aug 17, 2004
- Lam Research Corporation
- Alek Owczarz
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for chemical mechanical planarization
- Patent number 6,767,428
- Issue date Jul 27, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for controlled polishing and planarization of sem...
- Patent number 6,729,943
- Issue date May 4, 2004
- Lam Research Corporation
- Rod Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for polishing and planarizing semiconductor wafer...
- Patent number 6,705,930
- Issue date Mar 16, 2004
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Grant
Pressurized membrane platen design for improving performance in CMP...
- Patent number 6,607,425
- Issue date Aug 19, 2003
- Lam Research Corporation
- Rod Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for controlled polishing and planarization of sem...
- Patent number 6,340,326
- Issue date Jan 22, 2002
- Lam Research Corporation
- Rod Kistler
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for chemical mechanical planarization
- Publication number 20040238493
- Publication date Dec 2, 2004
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Method using active retainer rings for improving edge performance i...
- Publication number 20040235399
- Publication date Nov 25, 2004
- Lam Research Corp.
- Alek Owczarz
- B24 - GRINDING POLISHING
Information Patent Application
System and method for polishing and planarizing semiconductor wafer...
- Publication number 20040166782
- Publication date Aug 26, 2004
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Application
System and method for controlled polishing and planarization of sem...
- Publication number 20020137436
- Publication date Sep 26, 2002
- Lam Research Corporation
- Rod Kistler
- B24 - GRINDING POLISHING
Information Patent Application
Piezoelectric platen design for improving performance in CMP applic...
- Publication number 20020081945
- Publication date Jun 27, 2002
- Rod Kistler
- B24 - GRINDING POLISHING
Information Patent Application
Platen design for improving edge performance in CMP applications
- Publication number 20020081947
- Publication date Jun 27, 2002
- Alek Owczarz
- B24 - GRINDING POLISHING
Information Patent Application
System and method for polishing and planarizing semiconductor wafer...
- Publication number 20010012751
- Publication date Aug 9, 2001
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING

Rod Kistler

Person

Patents Grantslast 30 patents

Method for chemical mechanical planarization

Methods using active retainer rings for improving edge performance...

System and method for polishing and planarizing semiconductor wafer...

Apparatus for removal/remaining thickness profile manipulation

Platen design for improving edge performance in CMP applications

Method and apparatus for chemical mechanical planarization

System and method for controlled polishing and planarization of sem...

System and method for polishing and planarizing semiconductor wafer...

Pressurized membrane platen design for improving performance in CMP...

System and method for controlled polishing and planarization of sem...

Patents Applicationslast 30 patents

Method for chemical mechanical planarization

Method using active retainer rings for improving edge performance i...

System and method for polishing and planarizing semiconductor wafer...

System and method for controlled polishing and planarization of sem...

Piezoelectric platen design for improving performance in CMP applic...

Platen design for improving edge performance in CMP applications

System and method for polishing and planarizing semiconductor wafer...