Rodney C. Kistler

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making semiconductor structures implementing sacrificial...
- Patent number 7,875,548
- Issue date Jan 25, 2011
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure implementing sacrificial material and metho...
- Patent number 7,425,501
- Issue date Sep 16, 2008
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing slurry useful for copper substrates
- Patent number 7,381,648
- Issue date Jun 3, 2008
- Cabot Microelectronics Corporation
- Vlasta Brusic Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for real time metal film thickness measurement
- Patent number 7,309,618
- Issue date Dec 18, 2007
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus of arrayed, clustered or coupled eddy current...
- Patent number 7,205,166
- Issue date Apr 17, 2007
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Integration of sensor based metrology into semiconductor processing...
- Patent number 7,128,803
- Issue date Oct 31, 2006
- Lam Research Corporation
- Aleksander Owczarz
- B24 - GRINDING POLISHING
Information Patent Grant
Enhancement of eddy current based measurement capabilities
- Patent number 7,084,621
- Issue date Aug 1, 2006
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for slope to threshold conversion for process...
- Patent number 7,010,468
- Issue date Mar 7, 2006
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure implementing low-K dielectric materials and...
- Patent number 6,984,892
- Issue date Jan 10, 2006
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of arrayed sensors for metrological control
- Patent number 6,951,624
- Issue date Oct 4, 2005
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for detecting transitions of wafer surface pr...
- Patent number 6,937,915
- Issue date Aug 30, 2005
- Lam Research Corporation
- Rodney Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for metal residue detection and mapping within a...
- Patent number 6,929,531
- Issue date Aug 16, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for detecting transitions of wafer surface properties in ch...
- Patent number 6,925,348
- Issue date Aug 2, 2005
- Lam Research Corporation
- Rodney Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
Complementary sensors metrological process and method and apparatus...
- Patent number 6,922,053
- Issue date Jul 26, 2005
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad ironing system
- Patent number 6,896,596
- Issue date May 24, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for metrological process control implementing...
- Patent number 6,894,491
- Issue date May 17, 2005
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Byproduct control in linear chemical mechanical planarization system
- Patent number 6,890,245
- Issue date May 10, 2005
- Lam Research Corporation
- Rodney C. Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical assisted CMP
- Patent number 6,875,322
- Issue date Apr 5, 2005
- Lam Research Corporation
- Rodney C. Kistler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for slope to threshold conversion for process...
- Patent number 6,859,765
- Issue date Feb 22, 2005
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of arrayed sensors for metrological control
- Patent number 6,808,590
- Issue date Oct 26, 2004
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Chemical mechanical planarization (CMP) apparatus
- Patent number 6,769,961
- Issue date Aug 3, 2004
- Lam Research Corporation
- Rodney C. Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
Afferent-based polishing media for chemical mechanical planarization
- Patent number 6,752,693
- Issue date Jun 22, 2004
- Lam Research Corporation
- Rodney C. Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for fabricating interconnect structures having Low K dielec...
- Patent number 6,653,224
- Issue date Nov 25, 2003
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing slurry useful for copper substrates
- Patent number 6,620,037
- Issue date Sep 16, 2003
- Cabot Microelectronics Corporation
- Vlasta Brusic Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method useful for copper substrates
- Patent number 6,593,239
- Issue date Jul 15, 2003
- Cabot Microelectronics Corp.
- Vlasta Brusic Kaufman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing pad ironing system and method for implementing the same
- Patent number 6,579,157
- Issue date Jun 17, 2003
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing slurry useful for copper substrates
- Patent number 6,569,350
- Issue date May 27, 2003
- Cabot Microelectronics Corporation
- Vlasta Brusic Kaufman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Infrared end-point detection system
- Patent number 6,540,587
- Issue date Apr 1, 2003
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing slurry useful for copper/tantalum sub...
- Patent number 6,447,371
- Issue date Sep 10, 2002
- Cabot Microelectronics Corporation
- Vlasta Brusic Kaufman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical polishing slurry useful for copper substrates
- Patent number 6,432,828
- Issue date Aug 13, 2002
- Cabot Microelectronics Corporation
- Vlasta Brusic Kaufman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Method for Making Semiconductor Structures Implementing Sacrificial...
- Publication number 20090004845
- Publication date Jan 1, 2009
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF ARRAYED, CLUSTERED OR COUPLED EDDY CURRENT...
- Publication number 20070163712
- Publication date Jul 19, 2007
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor structure implementing sacrificial material and metho...
- Publication number 20060043596
- Publication date Mar 2, 2006
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE IMPLEMENTING LOW-K DIELECTRIC MATERIALS AND...
- Publication number 20050194688
- Publication date Sep 8, 2005
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for slope to threshold conversion for process...
- Publication number 20050125202
- Publication date Jun 9, 2005
- Lam Research Corporation
- Yehiel Gotkis
- G05 - CONTROLLING REGULATING
Information Patent Application
Integration of sensor based metrology into semiconductor processing...
- Publication number 20050072528
- Publication date Apr 7, 2005
- Lam Research Corporation
- Aleksander Owczarz
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for wafer mechanical stress monitoring and waf...
- Publication number 20050066739
- Publication date Mar 31, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Methods for detecting transitions of wafer surface properties in ch...
- Publication number 20050054268
- Publication date Mar 10, 2005
- Lam Research Corporation
- Rodney Kistler
- B24 - GRINDING POLISHING
Information Patent Application
Complementary sensors metrological process and method and apparatus...
- Publication number 20050007107
- Publication date Jan 13, 2005
- Lam Research Corp.
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of arrayed sensors for metrological control
- Publication number 20050000653
- Publication date Jan 6, 2005
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus of arrayed, clustered or coupled eddy current...
- Publication number 20040206455
- Publication date Oct 21, 2004
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR METROLOGICAL PROCESS CONTROL IMPLEMENTING...
- Publication number 20040119468
- Publication date Jun 24, 2004
- Lam Research Corp.
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for slope to threshold conversion for process...
- Publication number 20040117054
- Publication date Jun 17, 2004
- Lam Research Corporation
- Yehiel Gotkis
- G05 - CONTROLLING REGULATING
Information Patent Application
Enhancement of eddy current based measurement capabilities
- Publication number 20040058545
- Publication date Mar 25, 2004
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
System and method for metal residue detection and mapping within a...
- Publication number 20040058620
- Publication date Mar 25, 2004
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for applying differential removal rates to a s...
- Publication number 20040011462
- Publication date Jan 22, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing slurry useful for copper substrates
- Publication number 20040009671
- Publication date Jan 15, 2004
- Cabot Microelectronics Corporation
- Vlasta Brusic Kaufman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and apparatus for real time metal film thickness measurement
- Publication number 20040002171
- Publication date Jan 1, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad ironing system and methods for implementing the same
- Publication number 20030194956
- Publication date Oct 16, 2003
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing slurry useful for copper substrates
- Publication number 20020168923
- Publication date Nov 14, 2002
- Cabot Microelectronics Corp.
- Vlasta Brusic Kaufman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical mechanical polishing slurry useful for copper substrates
- Publication number 20020145127
- Publication date Oct 10, 2002
- Cabot Microelectronics Corp.
- Vlasta Brusic Kaufman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD USEFUL FOR COPPER SUBSTRATES
- Publication number 20020033382
- Publication date Mar 21, 2002
- VLASTA BRUSIC KAUFMAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY USEFUL FOR COPPER SUBSTRATES
- Publication number 20010049910
- Publication date Dec 13, 2001
- VLASTA BRUSIC KAUFMAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical mechanical polishing slurry useful for copper/tantalum sub...
- Publication number 20010041507
- Publication date Nov 15, 2001
- Vlasta Brusic Kaufman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Rodney C. Kistler

Person

Patents Grantslast 30 patents

Method for making semiconductor structures implementing sacrificial...

Semiconductor structure implementing sacrificial material and metho...

Chemical mechanical polishing slurry useful for copper substrates

Method and apparatus for real time metal film thickness measurement

Method and apparatus of arrayed, clustered or coupled eddy current...

Integration of sensor based metrology into semiconductor processing...

Enhancement of eddy current based measurement capabilities

Method and apparatus for slope to threshold conversion for process...

Semiconductor structure implementing low-K dielectric materials and...

Method and apparatus of arrayed sensors for metrological control

Apparatus and methods for detecting transitions of wafer surface pr...

System and method for metal residue detection and mapping within a...

Methods for detecting transitions of wafer surface properties in ch...

Complementary sensors metrological process and method and apparatus...

Polishing pad ironing system

Method and apparatus for metrological process control implementing...

Byproduct control in linear chemical mechanical planarization system

Electrochemical assisted CMP

Method and apparatus for slope to threshold conversion for process...

Method and apparatus of arrayed sensors for metrological control

Chemical mechanical planarization (CMP) apparatus

Afferent-based polishing media for chemical mechanical planarization

Methods for fabricating interconnect structures having Low K dielec...

Chemical mechanical polishing slurry useful for copper substrates

Chemical mechanical polishing method useful for copper substrates

Polishing pad ironing system and method for implementing the same

Chemical mechanical polishing slurry useful for copper substrates

Infrared end-point detection system

Chemical mechanical polishing slurry useful for copper/tantalum sub...

Chemical mechanical polishing slurry useful for copper substrates

Patents Applicationslast 30 patents

Method for Making Semiconductor Structures Implementing Sacrificial...

METHOD AND APPARATUS OF ARRAYED, CLUSTERED OR COUPLED EDDY CURRENT...

Semiconductor structure implementing sacrificial material and metho...

SEMICONDUCTOR STRUCTURE IMPLEMENTING LOW-K DIELECTRIC MATERIALS AND...

Method and apparatus for slope to threshold conversion for process...

Integration of sensor based metrology into semiconductor processing...

Method and apparatus for wafer mechanical stress monitoring and waf...

Methods for detecting transitions of wafer surface properties in ch...

Complementary sensors metrological process and method and apparatus...

Method and apparatus of arrayed sensors for metrological control

Method and apparatus of arrayed, clustered or coupled eddy current...

METHOD AND APPARATUS FOR METROLOGICAL PROCESS CONTROL IMPLEMENTING...

Method and apparatus for slope to threshold conversion for process...

Enhancement of eddy current based measurement capabilities

System and method for metal residue detection and mapping within a...

Method and apparatus for applying differential removal rates to a s...

Chemical mechanical polishing slurry useful for copper substrates

Method and apparatus for real time metal film thickness measurement

Polishing pad ironing system and methods for implementing the same

Chemical mechanical polishing slurry useful for copper substrates

Chemical mechanical polishing slurry useful for copper substrates

CHEMICAL MECHANICAL POLISHING METHOD USEFUL FOR COPPER SUBSTRATES

CHEMICAL MECHANICAL POLISHING SLURRY USEFUL FOR COPPER SUBSTRATES

Chemical mechanical polishing slurry useful for copper/tantalum sub...