Rodney C. Langley

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for plasma etching a wafer
- Patent number 6,838,390
- Issue date Jan 4, 2005
- Micron Technology, Inc.
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for inspecting wafers
- Patent number 6,424,733
- Issue date Jul 23, 2002
- Micron Technology, Inc.
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatuses, and methods of forming antire...
- Patent number 6,380,100
- Issue date Apr 30, 2002
- Micron Technology, Inc.
- J. Brett Rolfson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatuses
- Patent number 6,293,789
- Issue date Sep 25, 2001
- Micron Technology, Inc.
- J. Brett Rolfson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatuses, and methods of forming antire...
- Patent number 6,248,671
- Issue date Jun 19, 2001
- Micron Technology, Inc.
- J. Brett Rolfson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma etching a wafer
- Patent number 6,080,272
- Issue date Jun 27, 2000
- Micron Technology, Inc.
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bond pads
- Patent number 5,686,762
- Issue date Nov 11, 1997
- Micron Technology, Inc.
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to eliminate corrosion in conductive elements
- Patent number 5,376,235
- Issue date Dec 27, 1994
- Micron Semiconductor, Inc.
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and system for stabilizing layer deposition and etch rates...
- Patent number 5,221,414
- Issue date Jun 22, 1993
- Micron Technology, Inc.
- Rodney C. Langley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of passivating a semiconductor wafer
- Patent number 5,217,926
- Issue date Jun 8, 1993
- Micron Technology, Inc.
- Rodney Langley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for plasma etching a wafer
- Publication number 20050048781
- Publication date Mar 3, 2005
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for plasma etching a wafer
- Publication number 20020142593
- Publication date Oct 3, 2002
- Rodney C. Langley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor processing apparatuses, and methods of forming antire...
- Publication number 20010019899
- Publication date Sep 6, 2001
- J. Brett Rolfson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INSPECTING WAFERS
- Publication number 20010012392
- Publication date Aug 9, 2001
- RODNEY C. LANGLEY
- H01 - BASIC ELECTRIC ELEMENTS

Rodney C. Langley

Person

Patents Grantslast 30 patents

Method and apparatus for plasma etching a wafer

Method and apparatus for inspecting wafers

Semiconductor processing apparatuses, and methods of forming antire...

Semiconductor processing apparatuses

Semiconductor processing apparatuses, and methods of forming antire...

Method and apparatus for plasma etching a wafer

Semiconductor device with improved bond pads

Method to eliminate corrosion in conductive elements

Process and system for stabilizing layer deposition and etch rates...

Method of passivating a semiconductor wafer

Patents Applicationslast 30 patents

Method for plasma etching a wafer

Method and apparatus for plasma etching a wafer

Semiconductor processing apparatuses, and methods of forming antire...

METHOD AND APPARATUS FOR INSPECTING WAFERS