Rodney L. Hill

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for manufacturing thin film resistors using a tre...
- Patent number 8,679,932
- Issue date Mar 25, 2014
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure with a side wall spacer that protects...
- Patent number 8,282,846
- Issue date Oct 9, 2012
- National Semiconductor Corporation
- Rodney L. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for faceting the corners of a resistor protect la...
- Patent number 7,982,287
- Issue date Jul 19, 2011
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing a dual via architecture for thin fi...
- Patent number 7,960,240
- Issue date Jun 14, 2011
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for preventing metal corrosion on bond pads
- Patent number 7,875,546
- Issue date Jan 25, 2011
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for eliminating a mask layer during thin film resistor manuf...
- Patent number 7,829,428
- Issue date Nov 9, 2010
- National Semiconductor Corporation
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing a buried thin film resistor having...
- Patent number 7,808,048
- Issue date Oct 5, 2010
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for faceting a masking layer in a plasma etch to...
- Patent number 7,585,775
- Issue date Sep 8, 2009
- National Semiconductor Corporation
- Thomas Bold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for faceting the corners of a resistor protect la...
- Patent number 7,544,579
- Issue date Jun 9, 2009
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for faceting via top corners to improve metal fill
- Patent number 7,456,097
- Issue date Nov 25, 2008
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing a dual via architecture for thin fi...
- Patent number 7,410,879
- Issue date Aug 12, 2008
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing a buried thin film resistor having...
- Patent number 7,332,403
- Issue date Feb 19, 2008
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for manufacturing thin film resistors using a tre...
- Patent number 7,291,525
- Issue date Nov 6, 2007
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for using plasma to adjust the resistance of thin...
- Patent number 7,230,517
- Issue date Jun 12, 2007
- National Semiconductor Corporation
- Richard Wendell Foote, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deionized water degasification for semiconductor fabrication
- Patent number 6,416,676
- Issue date Jul 9, 2002
- National Semiconductor Corporation
- Rodney L. Hill
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming a Deep Trench Isolation Structure Using a Planari...
- Publication number 20120034756
- Publication date Feb 9, 2012
- Taehun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Interconnect Structure with a Side Wall Spacer that Protects...
- Publication number 20110209899
- Publication date Sep 1, 2011
- Rodney L. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS
- Publication number 20110084407
- Publication date Apr 14, 2011
- National Semiconductor Corporation
- Rodney Hill
- H01 - BASIC ELECTRIC ELEMENTS

Rodney L. Hill

Person

Patents Grantslast 30 patents

System and method for manufacturing thin film resistors using a tre...

Metal interconnect structure with a side wall spacer that protects...

System and method for faceting the corners of a resistor protect la...

System and method for providing a dual via architecture for thin fi...

System and method for preventing metal corrosion on bond pads

Method for eliminating a mask layer during thin film resistor manuf...

System and method for providing a buried thin film resistor having...

System and method for faceting a masking layer in a plasma etch to...

System and method for faceting the corners of a resistor protect la...

System and method for faceting via top corners to improve metal fill

System and method for providing a dual via architecture for thin fi...

System and method for providing a buried thin film resistor having...

System and method for manufacturing thin film resistors using a tre...

System and method for using plasma to adjust the resistance of thin...

Deionized water degasification for semiconductor fabrication

Patents Applicationslast 30 patents

Method of Forming a Deep Trench Isolation Structure Using a Planari...

Metal Interconnect Structure with a Side Wall Spacer that Protects...

SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS