Rodney L. Robison

Person

Kingston, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
System for backside deposition of a substrate
- Patent number 11,908,728
- Issue date Feb 20, 2024
- Tokyo Electron Limited
- Ronald Nasman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing system for electromagnetic wave treatment of a substrate...
- Patent number 10,426,001
- Issue date Sep 24, 2019
- Tokyo Electron Limited
- Ronald Nasman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-precision dispense system with meniscus control
- Patent number 10,354,872
- Issue date Jul 16, 2019
- Tokyo Electron Limited
- Anton J. deVilliers
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
High temperature electrostatic chuck and method of using
- Patent number 8,194,384
- Issue date Jun 5, 2012
- Tokyo Electron Limited
- Ronald Nasman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Plasma processing system with locally-efficient inductive plasma co...
- Patent number 8,028,655
- Issue date Oct 4, 2011
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionized physical vapor deposition (iPVD) process
- Patent number 7,901,545
- Issue date Mar 8, 2011
- Tokyo Electron Limited
- Frank M. Cerio, Jr.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing system with locally-efficient inductive plasma co...
- Patent number 7,810,449
- Issue date Oct 12, 2010
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective-redeposition structures for calibrating a plasma process
- Patent number 7,776,748
- Issue date Aug 17, 2010
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contacts for integrated circuits and methods of forming...
- Patent number 7,772,110
- Issue date Aug 10, 2010
- Tokyo Electron Limited
- Rodney L. Robison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective-redeposition sources for calibrating a plasma process
- Patent number 7,749,398
- Issue date Jul 6, 2010
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionized PVD with sequential deposition and etching
- Patent number 7,744,735
- Issue date Jun 29, 2010
- Tokyo Electron Limited
- Rodney Lee Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced reliability deposition baffle for iPVD
- Patent number 7,591,935
- Issue date Sep 22, 2009
- Tokyo Electron Limited
- Jozef Brcka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing system with locally-efficient inductive plasma co...
- Patent number 7,273,533
- Issue date Sep 25, 2007
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionized PVD with sequential deposition and etching
- Patent number 6,755,945
- Issue date Jun 29, 2004
- Tokyo Electron Limited
- Tugrul Yasar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Transport system for wafer processing line
- Patent number 6,183,615
- Issue date Feb 6, 2001
- Tokyo Electron Limited
- Tugrul Yasar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligning in-situ ellipsometer and method of using for process...
- Patent number 5,408,322
- Issue date Apr 18, 1995
- Materials Research Corporation
- Jon S. Hsu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR BACKSIDE DEPOSITION OF A SUBSTRATE
- Publication number 20190035646
- Publication date Jan 31, 2019
- TOKYO ELECTRON LIMITED
- Ronald Nasman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VORTICAL ATOMIZING NOZZLE ASSEMBLY, VAPORIZER, AND RELATED METHODS...
- Publication number 20180066363
- Publication date Mar 8, 2018
- TOKYO ELECTRON LIMITED
- Ronald Nasman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High-Precision Dispense System With Meniscus Control
- Publication number 20180047563
- Publication date Feb 15, 2018
- TOKYO ELECTRON LIMITED
- Anton J. deVilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Purity Dispense System
- Publication number 20180047562
- Publication date Feb 15, 2018
- TOKYO ELECTRON LIMITED
- Anton J. deVilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Generating Backside Substrate Texture Maps...
- Publication number 20150211836
- Publication date Jul 30, 2015
- TOKYO ELECTRON LIMITED
- Anton J. deVilliers
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING SYSTEM FOR ELECTROMAGNETIC WAVE TREATMENT OF A SUBSTRATE...
- Publication number 20140273532
- Publication date Sep 18, 2014
- TOKYO ELECTRON LIMITED
- Ronald Nasman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING SYSTEM WITH LOCALLY-EFFICIENT INDUCTIVE PLASMA CO...
- Publication number 20110146911
- Publication date Jun 23, 2011
- TOKYO ELECTRON LIMITED
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE ELECTROSTATIC CHUCK AND METHOD OF USING
- Publication number 20100020463
- Publication date Jan 28, 2010
- TOKYO ELECTRON LIMITED
- Ronald Nasman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
IONIZED PHYSICAL VAPOR DEPOSITION (iPVD) PROCESS
- Publication number 20090321247
- Publication date Dec 31, 2009
- TOKYO ELECTRON LIMITED
- Frank M. Cerio, JR.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING METAL-CONTAINING FILMS BY INDUCTIVELY COUPLED...
- Publication number 20090242385
- Publication date Oct 1, 2009
- TOKYO ELECTRON LIMITED
- Rodney L. Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR RF GROUNDING OF IPVD TABLE
- Publication number 20090242383
- Publication date Oct 1, 2009
- TOKYO ELECTRON LIMITED
- Mirko Vukovic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING SYSTEM WITH LOCALLY-EFFICIENT INDUCTIVE PLASMA CO...
- Publication number 20090200949
- Publication date Aug 13, 2009
- TOKYO ELECTRON LIMITED
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACTS FOR INTEGRATED CIRCUITS AND METHODS OF FORMING...
- Publication number 20090085211
- Publication date Apr 2, 2009
- TOKYO ELECTRON LIMITED
- Rodney L. Robison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE-REDEPOSITION SOURCES FOR CALIBRATING A PLASMA PROCESS
- Publication number 20080087638
- Publication date Apr 17, 2008
- TOKYO ELECTRON LIMITED
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE-REDEPOSITION STRUCTURES FOR CALIBRATING A PLASMA PROCESS
- Publication number 20080081482
- Publication date Apr 3, 2008
- TOKYO ELECTRON LIMITED
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced reliability deposition baffle for iPVD
- Publication number 20070131544
- Publication date Jun 14, 2007
- Jozef Brcka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized physical vapor deposition (iPVD) process
- Publication number 20050211545
- Publication date Sep 29, 2005
- Frank M. Cerio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processing system with locally-efficient inductive plasma co...
- Publication number 20050103445
- Publication date May 19, 2005
- TOKYO ELECTRON LIMITED
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ionized PVD with sequential deposition and etching
- Publication number 20040188239
- Publication date Sep 30, 2004
- Rodney Lee Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized PVD with sequential deposition and etching
- Publication number 20030034244
- Publication date Feb 20, 2003
- Tugrul Yasar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Rodney L. Robison

Person

Patents Grantslast 30 patents

System for backside deposition of a substrate

Processing system for electromagnetic wave treatment of a substrate...

High-precision dispense system with meniscus control

High temperature electrostatic chuck and method of using

Plasma processing system with locally-efficient inductive plasma co...

Ionized physical vapor deposition (iPVD) process

Plasma processing system with locally-efficient inductive plasma co...

Selective-redeposition structures for calibrating a plasma process

Electrical contacts for integrated circuits and methods of forming...

Selective-redeposition sources for calibrating a plasma process

Ionized PVD with sequential deposition and etching

Enhanced reliability deposition baffle for iPVD

Plasma processing system with locally-efficient inductive plasma co...

Ionized PVD with sequential deposition and etching

Transport system for wafer processing line

Self aligning in-situ ellipsometer and method of using for process...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR BACKSIDE DEPOSITION OF A SUBSTRATE

VORTICAL ATOMIZING NOZZLE ASSEMBLY, VAPORIZER, AND RELATED METHODS...

High-Precision Dispense System With Meniscus Control

High-Purity Dispense System

Systems and Methods for Generating Backside Substrate Texture Maps...

PROCESSING SYSTEM FOR ELECTROMAGNETIC WAVE TREATMENT OF A SUBSTRATE...

PLASMA PROCESSING SYSTEM WITH LOCALLY-EFFICIENT INDUCTIVE PLASMA CO...

HIGH TEMPERATURE ELECTROSTATIC CHUCK AND METHOD OF USING

IONIZED PHYSICAL VAPOR DEPOSITION (iPVD) PROCESS

METHOD OF DEPOSITING METAL-CONTAINING FILMS BY INDUCTIVELY COUPLED...

APPARATUS AND METHOD FOR RF GROUNDING OF IPVD TABLE

PLASMA PROCESSING SYSTEM WITH LOCALLY-EFFICIENT INDUCTIVE PLASMA CO...

ELECTRICAL CONTACTS FOR INTEGRATED CIRCUITS AND METHODS OF FORMING...

SELECTIVE-REDEPOSITION SOURCES FOR CALIBRATING A PLASMA PROCESS

SELECTIVE-REDEPOSITION STRUCTURES FOR CALIBRATING A PLASMA PROCESS

Enhanced reliability deposition baffle for iPVD

Ionized physical vapor deposition (iPVD) process

Plasma processing system with locally-efficient inductive plasma co...

Ionized PVD with sequential deposition and etching

Ionized PVD with sequential deposition and etching