Roel Adeva ROBLES

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with integrated shielding
- Patent number 11,901,308
- Issue date Feb 13, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies electrically connected to a package substrate by lead...
- Patent number 11,227,818
- Issue date Jan 18, 2022
- UTAC HEADQUARTERS PTE. LTD.
- Wing Keung Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with electromagnetic interference shielding
- Patent number 10,714,431
- Issue date Jul 14, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a heat spreader and method of manufactur...
- Patent number 10,658,277
- Issue date May 19, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer leadless semiconductor package and method of manufactur...
- Patent number 10,573,590
- Issue date Feb 25, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,354,934
- Issue date Jul 16, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,978,658
- Issue date May 22, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,508,623
- Issue date Nov 29, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with under bump metallization aligned with op...
- Patent number 8,030,768
- Issue date Oct 4, 2011
- United Test & Assembly Center Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING
- Publication number 20220028798
- Publication date Jan 27, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth SIRINORAKUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20210035891
- Publication date Feb 4, 2021
- UTAC Headquarters Pte. Ltd.
- Wing Keung LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20190051585
- Publication date Feb 14, 2019
- UTAC Headquarters Pte. Ltd.
- Antonio Bambalan DIMAANO JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190051614
- Publication date Feb 14, 2019
- UTAC Headquarters Pte. Ltd.
- Antonio Bambalan DIMAANO JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20180240726
- Publication date Aug 23, 2018
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTUR...
- Publication number 20180114749
- Publication date Apr 26, 2018
- UTAC Headquarters Pte. Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170077007
- Publication date Mar 16, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150357256
- Publication date Dec 10, 2015
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ON VIA-PACKAGING AND METHODOLOGIES
- Publication number 20080284015
- Publication date Nov 20, 2008
- United Test and Assembly Center, Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS

Roel Adeva ROBLES

Person

Patents Grantslast 30 patents

Semiconductor packages with integrated shielding

Stacked dies electrically connected to a package substrate by lead...

Semiconductor packages with electromagnetic interference shielding

Semiconductor package with a heat spreader and method of manufactur...

Multi-layer leadless semiconductor package and method of manufactur...

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor package with under bump metallization aligned with op...

Patents Applicationslast 30 patents

Semiconductor Device Carriers and Methods of Making and Using

SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

THERMALLY ENHANCED LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

MULTI-LAYER LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

BUMP ON VIA-PACKAGING AND METHODOLOGIES