Roel Daamen

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits separated by through-wafer trench isolation
- Patent number 9,177,852
- Issue date Nov 3, 2015
- NXP B.V.
- Peter Gerard Steeneken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits separated by through-wafer trench isolation
- Patent number 8,853,816
- Issue date Oct 7, 2014
- NXP B.V.
- Peter Gerard Steeneken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of in-laid metal interconnects
- Patent number 8,367,552
- Issue date Feb 5, 2013
- NXP B.V.
- Roel Daamen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION
- Publication number 20140342527
- Publication date Nov 20, 2014
- Peter Gerard STEENEKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION
- Publication number 20140151844
- Publication date Jun 5, 2014
- NXP B.V.
- Peter Gerard STEENEKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Manufacturing Method
- Publication number 20130193417
- Publication date Aug 1, 2013
- NXP B.V.
- Youri Victorovitch Ponomarev
- G01 - MEASURING TESTING
Information Patent Application
Method for fabrication of in-laid metal interconnects
- Publication number 20110097896
- Publication date Apr 28, 2011
- Koninklijke Philips Electronics N.V.
- Roel Daamen
- H01 - BASIC ELECTRIC ELEMENTS