Roelf Anco Jacob GROENHUIS

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of packaging a semiconductor die and package formed by the...
- Patent number 8,183,682
- Issue date May 22, 2012
- NXP B.V.
- Paul Dijkstra
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Air cavity package for a semiconductor die and methods of forming t...
- Patent number 7,944,062
- Issue date May 17, 2011
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing thereof
- Patent number 7,858,444
- Issue date Dec 28, 2010
- NXP B.V.
- Cornelis Gerardus Schriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing thereof
- Patent number 7,514,801
- Issue date Apr 7, 2009
- NXP B.V.
- Cornelis Gerardus Schriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, method of manufacturing a carrier and an electronic device
- Patent number 7,247,938
- Issue date Jul 24, 2007
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Method of manufacturing an electronic component and electronic comp...
- Patent number 7,022,588
- Issue date Apr 4, 2006
- Koninklijke Philips Electronics N.V.
- Johan Bosman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20120286410
- Publication date Nov 15, 2012
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
- Publication number 20120286399
- Publication date Nov 15, 2012
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
- Publication number 20120181678
- Publication date Jul 19, 2012
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20120112351
- Publication date May 10, 2012
- NXP B.V.
- Sven WALCZYK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LE...
- Publication number 20110198738
- Publication date Aug 18, 2011
- NXP B.V.
- Peter WIilhelmus Maria Van De Water
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20100117171
- Publication date May 13, 2010
- NXP, B.V.
- Paulus Martinus Catharina Hesen
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20090162791
- Publication date Jun 25, 2009
- NXP B.V.
- Cornelis Gerardus SCHRIKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging a Semiconductor Die and Package Formed by the...
- Publication number 20080277772
- Publication date Nov 13, 2008
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Cavity Package for a Semiconductor Die and Methods of Forming t...
- Publication number 20080272475
- Publication date Nov 6, 2008
- NXP B.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS

Roelf Anco Jacob GROENHUIS

Person

Patents Grantslast 30 patents

Methods of packaging a semiconductor die and package formed by the...

Air cavity package for a semiconductor die and methods of forming t...

Electronic device and method of manufacturing thereof

Electronic device and method of manufacturing thereof

Carrier, method of manufacturing a carrier and an electronic device

Method of manufacturing an electronic component and electronic comp...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE

LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE

METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LE...

SENSOR PACKAGE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF

Methods of Packaging a Semiconductor Die and Package Formed by the...

Air Cavity Package for a Semiconductor Die and Methods of Forming t...