Roey Shaviv

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of using a segmented showerhead for uniform delivery of mul...
- Patent number 12,043,895
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Alexander Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead for providing multiple materials to a process chamber
- Patent number 11,970,775
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Prashanth Kothnur
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented showerhead for uniform delivery of multiple precursors
- Patent number 11,834,743
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Alexander Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Evaporator chamber for forming films on substrates
- Patent number 11,692,261
- Issue date Jul 4, 2023
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alignment module with a cleaning chamber
- Patent number 11,637,004
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for aligning a mask with a substrate
- Patent number 11,538,706
- Issue date Dec 27, 2022
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming films on substrates
- Patent number 11,505,863
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing system for forming layers
- Patent number 11,414,740
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for controlling a flow process material to a d...
- Patent number 11,393,703
- Issue date Jul 19, 2022
- Applied Materials, Inc.
- Alexander Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced plating bath and additive chemistries for cobalt plating
- Patent number 11,118,278
- Issue date Sep 14, 2021
- Applied Materials, Inc.
- Ismail Emesh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,075,165
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetized substrate carrier apparatus with shadow mask for deposition
- Patent number 11,056,277
- Issue date Jul 6, 2021
- Applied Materials, Inc.
- Daniel Lee Diehl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate carrier having hard mask
- Patent number 11,047,039
- Issue date Jun 29, 2021
- Applied Materials, Inc.
- Alexander Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for hybrid feature metallization
- Patent number 11,024,537
- Issue date Jun 1, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for filling a feature disposed in a substrate
- Patent number 10,950,500
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt removal for bottom up gapfill
- Patent number 10,770,346
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for asymmetric deposition of metal on high aspect ratio nan...
- Patent number 10,636,655
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Ben-Li Sheu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Co or Ni and Cu integration for small and large features in integra...
- Patent number 10,622,252
- Issue date Apr 14, 2020
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced plating bath and additive chemistries for cobalt plating
- Patent number 10,487,410
- Issue date Nov 26, 2019
- Applied Materials, Inc.
- Ismail Emesh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective cobalt removal for bottom up gapfill
- Patent number 10,163,696
- Issue date Dec 25, 2018
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus with membrane tube shield
- Patent number 10,081,881
- Issue date Sep 25, 2018
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for producing interconnects in semiconductor devices
- Patent number 10,062,607
- Issue date Aug 28, 2018
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of electrochemical deposition for void-free gap fill
- Patent number 10,000,860
- Issue date Jun 19, 2018
- Applied Materials, Inc.
- Serdar Aksu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electrochemically depositing metal on a reactive metal film
- Patent number 9,840,788
- Issue date Dec 12, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electrochemically depositing metal on a reactive metal film
- Patent number 9,828,687
- Issue date Nov 28, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Co or Ni and Cu integration for small and large features in integra...
- Patent number 9,805,976
- Issue date Oct 31, 2017
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electrochemical deposition on a workpiece i...
- Patent number 9,768,060
- Issue date Sep 19, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Forming cobalt interconnections on a substrate
- Patent number 9,758,896
- Issue date Sep 12, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SEGMENTED SHOWERHEAD FOR UNIFORM DELIVERY OF MULTIPLE PRE-CURSORS
- Publication number 20230092987
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- ALEXANDER LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING FILMS ON SUBSTRATES
- Publication number 20230042777
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A D...
- Publication number 20220351988
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- ALEXANDER LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTANCE AND HIGH RELIABILITY METALLIZATION MODULE
- Publication number 20220108917
- Publication date Apr 7, 2022
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210320064
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR DELIVERY METHODS AND APPARATUS
- Publication number 20210069745
- Publication date Mar 11, 2021
- Applied Materials, Inc.
- Alexander N. LERNER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS AND APPARATUS FOR HYBRID FEATURE METALLIZATION
- Publication number 20210043506
- Publication date Feb 11, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVAPORATOR CHAMBER FOR FORMING FILMS ON SUBSTRATES
- Publication number 20210025048
- Publication date Jan 28, 2021
- Applied Materials, Inc.
- Alexander N. LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210020569
- Publication date Jan 21, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM FOR FORMING LAYERS
- Publication number 20200385851
- Publication date Dec 10, 2020
- Applied Materials, Inc.
- Alexander N. LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS FOR FORMING FILMS ON SUBSTRATES
- Publication number 20200378000
- Publication date Dec 3, 2020
- Applied Materials, Inc.
- Alexander N. Lerner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR ALIGNING A MASK WITH A SUBSTRATE
- Publication number 20200373183
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Alexander N. LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MODULE WITH A CLEANING CHAMBER
- Publication number 20200373134
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Alexander N. LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE
- Publication number 20200251340
- Publication date Aug 6, 2020
- Applied Materials, Inc.
- ROEY SHAVIV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...
- Publication number 20200219720
- Publication date Jul 9, 2020
- Applied Materials, Inc.
- BEN-LI SHEU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MAGNETIZED SUBSTRATE CARRIER APPARATUS WITH SHADOW MASK FOR DEPOSITION
- Publication number 20200211769
- Publication date Jul 2, 2020
- Applied Materials, Inc.
- DANIEL LEE DIEHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEGMENTED SHOWERHEAD FOR UNIFORM DELIVERY OF MULTIPLE PRECURSORS
- Publication number 20200087790
- Publication date Mar 19, 2020
- Applied Materials, Inc.
- ALEXANDER LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING
- Publication number 20200048784
- Publication date Feb 13, 2020
- Applied Materials, Inc.
- Ismail EMESH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SHOWERHEAD FOR PROVIDING MULTIPLE MATERIALS TO A PROCESS CHAMBER
- Publication number 20200048767
- Publication date Feb 13, 2020
- Applied Materials, Inc.
- PRASHANTH KOTHNUR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A D...
- Publication number 20190382890
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- ALEXANDER LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...
- Publication number 20190287791
- Publication date Sep 19, 2019
- BEN-LI SHEU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE CARRIER HAVING HARD MASK
- Publication number 20190211442
- Publication date Jul 11, 2019
- Applied Materials, Inc.
- ALEXANDER LERNER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF ETCHING A TUNGSTEN LAYER
- Publication number 20190198392
- Publication date Jun 27, 2019
- AMRITA B. MULLICK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL
- Publication number 20190122923
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE
- Publication number 20180323103
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ELECTROCHEMICAL DEPOSITION FOR VOID-FREE GAP FILL
- Publication number 20180171502
- Publication date Jun 21, 2018
- Applied Materials, Inc.
- Serdar Aksu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL
- Publication number 20180138085
- Publication date May 17, 2018
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...
- Publication number 20180122696
- Publication date May 3, 2018
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING
- Publication number 20170247806
- Publication date Aug 31, 2017
- Applied Materials, Inc.
- Ismail EMESH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...
- Publication number 20170200642
- Publication date Jul 13, 2017
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS

Roey Shaviv

Person

Patents Grantslast 30 patents

Low resistance and high reliability metallization module

Methods of using a segmented showerhead for uniform delivery of mul...

Showerhead for providing multiple materials to a process chamber

Methods and apparatus for forming dual metal interconnects

Segmented showerhead for uniform delivery of multiple precursors

Evaporator chamber for forming films on substrates

Alignment module with a cleaning chamber

System and method for aligning a mask with a substrate

Methods for forming films on substrates

Processing system for forming layers

Apparatus and method for controlling a flow process material to a d...

Enhanced plating bath and additive chemistries for cobalt plating

Methods and apparatus for forming dual metal interconnects

Magnetized substrate carrier apparatus with shadow mask for deposition

Substrate carrier having hard mask

Methods and apparatus for hybrid feature metallization

Methods and apparatus for filling a feature disposed in a substrate

Selective cobalt removal for bottom up gapfill

Methods for asymmetric deposition of metal on high aspect ratio nan...

Co or Ni and Cu integration for small and large features in integra...

Enhanced plating bath and additive chemistries for cobalt plating

Selective cobalt removal for bottom up gapfill

Electroplating apparatus with membrane tube shield

Methods for producing interconnects in semiconductor devices

Methods of electrochemical deposition for void-free gap fill

Method for electrochemically depositing metal on a reactive metal film

Method for electrochemically depositing metal on a reactive metal film

Co or Ni and Cu integration for small and large features in integra...

Systems and methods for electrochemical deposition on a workpiece i...

Forming cobalt interconnections on a substrate

Patents Applicationslast 30 patents

SEGMENTED SHOWERHEAD FOR UNIFORM DELIVERY OF MULTIPLE PRE-CURSORS

METHODS FOR FORMING FILMS ON SUBSTRATES

APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A D...

LOW RESISTANCE AND HIGH RELIABILITY METALLIZATION MODULE

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

VAPOR DELIVERY METHODS AND APPARATUS

METHODS AND APPARATUS FOR HYBRID FEATURE METALLIZATION

EVAPORATOR CHAMBER FOR FORMING FILMS ON SUBSTRATES

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

PROCESSING SYSTEM FOR FORMING LAYERS

METHODS AND SYSTEMS FOR FORMING FILMS ON SUBSTRATES

SYSTEM AND METHOD FOR ALIGNING A MASK WITH A SUBSTRATE

ALIGNMENT MODULE WITH A CLEANING CHAMBER

METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE

APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...

MAGNETIZED SUBSTRATE CARRIER APPARATUS WITH SHADOW MASK FOR DEPOSITION

SEGMENTED SHOWERHEAD FOR UNIFORM DELIVERY OF MULTIPLE PRECURSORS

ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING

SHOWERHEAD FOR PROVIDING MULTIPLE MATERIALS TO A PROCESS CHAMBER

APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A D...

APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...

SUBSTRATE CARRIER HAVING HARD MASK

METHODS OF ETCHING A TUNGSTEN LAYER

SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL

METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE

METHODS OF ELECTROCHEMICAL DEPOSITION FOR VOID-FREE GAP FILL

SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL

CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...

ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING

CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...