Roger D. Hamilton

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device assembly
- Patent number 10,779,391
- Issue date Sep 15, 2020
- International Business Machines Corporation
- David Barron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module placement apparatus
- Patent number 10,109,975
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Jason R. Eagle
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Integrated circuit device assembly
- Patent number 9,913,361
- Issue date Mar 6, 2018
- International Business Machines Corporation
- David Barron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing heat sink loading having multipoint loading with actua...
- Patent number 9,265,157
- Issue date Feb 16, 2016
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing loading and heat removal for hub module assembly
- Patent number 8,363,404
- Issue date Jan 29, 2013
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,944,698
- Issue date May 17, 2011
- International Business Machines Corporation
- John Lee Colbert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heatsink apparatus for applying a specified compressive force to an...
- Patent number 7,777,329
- Issue date Aug 17, 2010
- International Business Machines Corporation
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically connecting two substrates using a resilient wire bundl...
- Patent number 7,765,693
- Issue date Aug 3, 2010
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,606,033
- Issue date Oct 20, 2009
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,486,516
- Issue date Feb 3, 2009
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-influencing fastener for mounting a heat sink in contact with a...
- Patent number 7,345,881
- Issue date Mar 18, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrically connecting two substrates usi...
- Patent number 7,293,994
- Issue date Nov 13, 2007
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for managing aligning and coupling of a land g...
- Patent number 7,071,720
- Issue date Jul 4, 2006
- International Business Machines Corporation
- John Lee Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting a heat transfer apparatus upon an...
- Patent number 6,988,533
- Issue date Jan 24, 2006
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside installation apparatus for land grid array modules
- Patent number 6,802,733
- Issue date Oct 12, 2004
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method of determining loading characteristic...
- Patent number 6,792,375
- Issue date Sep 14, 2004
- International Business Machines Corporation
- John Lee Colbert
- G01 - MEASURING TESTING
Information Patent Grant
Method of installing a land grid array multi-chip modules
- Patent number 6,757,965
- Issue date Jul 6, 2004
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting a land grid array module
- Patent number 6,634,095
- Issue date Oct 21, 2003
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array socket actuation hardware for MCM applications
- Patent number 6,475,011
- Issue date Nov 5, 2002
- International Business Machines Corporation
- Arvind K. Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array subassembly for multichip modules
- Patent number 6,449,155
- Issue date Sep 10, 2002
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe heat sink assembly for cooling semiconductor chips
- Patent number 6,385,044
- Issue date May 7, 2002
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Push pin assembly for heat sink for cooling electronic modules
- Patent number 6,061,240
- Issue date May 9, 2000
- International Business Machines Corporation
- Matthew Allen Butterbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual heat sink assembly for cooling multiple electronic modules
- Patent number 5,978,223
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Roger Duane Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-directional cooling arrangement for use with an electronic compo...
- Patent number 5,940,266
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Roger Duane Hamilton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for preventing leakage of electromagnetic radiation from...
- Patent number 5,929,377
- Issue date Jul 27, 1999
- International Business Machines Corporation
- Roger Duane Hamilton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink assembly for cooling electronic modules
- Patent number 5,870,286
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Matthew Allen Butterbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board covers for an electronics package
- Patent number 5,617,296
- Issue date Apr 1, 1997
- International Business Machines Corporation
- James A. Melville
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE ASSEMBLY
- Publication number 20180160524
- Publication date Jun 7, 2018
- International Business Machines Corporation
- David BARRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE ASSEMBLY
- Publication number 20170196075
- Publication date Jul 6, 2017
- International Business Machines Corporation
- David Barron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE PLACEMENT APPARATUS
- Publication number 20170133810
- Publication date May 11, 2017
- International Business Machines Corporation
- Jason R. Eagle
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUA...
- Publication number 20140268575
- Publication date Sep 18, 2014
- International Business Machines Corporation
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY
- Publication number 20120147563
- Publication date Jun 14, 2012
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electrically Connecting Two Substrates Using a Resilient Wire Bundl...
- Publication number 20080282539
- Publication date Nov 20, 2008
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting a Heat Sink in Thermal Contact with an Electronic Component
- Publication number 20080264603
- Publication date Oct 30, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting a Heat Sink in Thermal Contact with an Electronic Component
- Publication number 20080259572
- Publication date Oct 23, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heatsink Apparatus for Applying a Specified Compressive Force to an...
- Publication number 20080024991
- Publication date Jan 31, 2008
- John L. Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Influencing Fastener for Mounting a Heat Sink in Contact with a...
- Publication number 20070247813
- Publication date Oct 25, 2007
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Electrically Connecting Two Substrates Usi...
- Publication number 20070227769
- Publication date Oct 4, 2007
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Electrically Connecting Two Substrates Usi...
- Publication number 20070226997
- Publication date Oct 4, 2007
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for electrically connecting two substrates usi...
- Publication number 20070134948
- Publication date Jun 14, 2007
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for mounting a heat sink in thermal contact wi...
- Publication number 20070035937
- Publication date Feb 15, 2007
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for managing aligning and coupling of a land g...
- Publication number 20050275420
- Publication date Dec 15, 2005
- International Business Machines Corporation
- John Lee Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for mounting a heat transfer apparatus upon an...
- Publication number 20050006055
- Publication date Jan 13, 2005
- International Business Machines Corporation, Armonk, New York
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, system, and method of determining loading characteristic...
- Publication number 20040088121
- Publication date May 6, 2004
- International Busines Machines Corporation
- John Lee Colbert
- G01 - MEASURING TESTING
Information Patent Application
Holding member for the installation of land grid array multi-chip m...
- Publication number 20030192180
- Publication date Oct 16, 2003
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Topside Installation apparatus for land grid array modules
- Publication number 20030036301
- Publication date Feb 20, 2003
- International Business Machines Corporation
- John L. Colbert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Holding member for the installation of land grid array multi-chip m...
- Publication number 20030000080
- Publication date Jan 2, 2003
- International Business Machines Corporation
- John L. Colbert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Roger D. Hamilton

Person

Patents Grantslast 30 patents

Integrated circuit device assembly

Module placement apparatus

Integrated circuit device assembly

Implementing heat sink loading having multipoint loading with actua...

Implementing loading and heat removal for hub module assembly

Mounting a heat sink in thermal contact with an electronic component

Heatsink apparatus for applying a specified compressive force to an...

Electrically connecting two substrates using a resilient wire bundl...

Mounting a heat sink in thermal contact with an electronic component

Mounting a heat sink in thermal contact with an electronic component

Non-influencing fastener for mounting a heat sink in contact with a...

Method and apparatus for electrically connecting two substrates usi...

Method and apparatus for managing aligning and coupling of a land g...

Method and apparatus for mounting a heat transfer apparatus upon an...

Topside installation apparatus for land grid array modules

Apparatus, system, and method of determining loading characteristic...

Method of installing a land grid array multi-chip modules

Apparatus for mounting a land grid array module

Land grid array socket actuation hardware for MCM applications

Land grid array subassembly for multichip modules

Heat pipe heat sink assembly for cooling semiconductor chips

Push pin assembly for heat sink for cooling electronic modules

Dual heat sink assembly for cooling multiple electronic modules

Bi-directional cooling arrangement for use with an electronic compo...

Apparatus for preventing leakage of electromagnetic radiation from...

Heat sink assembly for cooling electronic modules

Printed circuit board covers for an electronics package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE ASSEMBLY

INTEGRATED CIRCUIT DEVICE ASSEMBLY

MODULE PLACEMENT APPARATUS

IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUA...

IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY

Electrically Connecting Two Substrates Using a Resilient Wire Bundl...

Mounting a Heat Sink in Thermal Contact with an Electronic Component

Mounting a Heat Sink in Thermal Contact with an Electronic Component

Heatsink Apparatus for Applying a Specified Compressive Force to an...

Non-Influencing Fastener for Mounting a Heat Sink in Contact with a...

Method and Apparatus for Electrically Connecting Two Substrates Usi...

Method and Apparatus for Electrically Connecting Two Substrates Usi...

Method and apparatus for electrically connecting two substrates usi...

Method and apparatus for mounting a heat sink in thermal contact wi...

Method and apparatus for managing aligning and coupling of a land g...

Method and apparatus for mounting a heat transfer apparatus upon an...

Apparatus, system, and method of determining loading characteristic...

Holding member for the installation of land grid array multi-chip m...

Topside Installation apparatus for land grid array modules

Holding member for the installation of land grid array multi-chip m...