Roger J. Hooey

Person

Rockwall, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging techniques for a high-density power converter
- Patent number 7,474,185
- Issue date Jan 6, 2009
- NetPower Technologies, Inc.
- Roger Hooey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging techniques for a high-density power converter
- Patent number 6,940,384
- Issue date Sep 6, 2005
- Netpower Technologies, Inc.
- Roger Hooey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Top mounted cooling device using heat pipes
- Patent number 6,394,175
- Issue date May 28, 2002
- Lucent Technologies Inc.
- Shiaw-Jong S. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature liquid transfer pump and method of manufacturing same
- Patent number 6,386,844
- Issue date May 14, 2002
- Lucent Technologies Inc.
- Shiaw-Jong Steve Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Header, a method of manufacture thereof and an electronic device em...
- Patent number 6,377,466
- Issue date Apr 23, 2002
- Lucent Technologies Inc.
- Shiaw-Jong Steve Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixed conductive pin for printed wiring substrate electronics case...
- Patent number 6,320,762
- Issue date Nov 20, 2001
- Shiaw-Jong S. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated power supply with a high thermal conductivity molded i...
- Patent number 6,317,324
- Issue date Nov 13, 2001
- Shiaw-Jong Steve Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board apparatus
- Patent number 6,301,120
- Issue date Oct 9, 2001
- Lucent Technologies Inc.
- Shiaw-Jong Steve Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated active cooling device for board mounted electric components
- Patent number 6,263,957
- Issue date Jul 24, 2001
- Lucent Technologies Inc.
- Shiaw-Jong S. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via plate electrical connector and method of manufacture th...
- Patent number 6,206,708
- Issue date Mar 27, 2001
- Lucent Technologies, Inc.
- Shiaw-Jong S. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-locking conductive pin for printed wiring substrate electronic...
- Patent number 6,144,557
- Issue date Nov 7, 2000
- Lucent Technologies, Inc.
- Shiaw-Jong S. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packaging techniques for a high-density power converter
- Publication number 20050242913
- Publication date Nov 3, 2005
- Roger Hooey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging techniques for a high-density power converter
- Publication number 20030174037
- Publication date Sep 18, 2003
- Roger Hooey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Roger J. Hooey

Person

Patents Grantslast 30 patents

Packaging techniques for a high-density power converter

Packaging techniques for a high-density power converter

Top mounted cooling device using heat pipes

Miniature liquid transfer pump and method of manufacturing same

Header, a method of manufacture thereof and an electronic device em...

Fixed conductive pin for printed wiring substrate electronics case...

Encapsulated power supply with a high thermal conductivity molded i...

Circuit board apparatus

Integrated active cooling device for board mounted electric components

Through via plate electrical connector and method of manufacture th...

Self-locking conductive pin for printed wiring substrate electronic...

Patents Applicationslast 30 patents

Packaging techniques for a high-density power converter

Packaging techniques for a high-density power converter