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Roger Lam
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Fishkill, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic module assembly with patterned adhesive array
Patent number
9,293,439
Issue date
Mar 22, 2016
GLOBALFOUNDRIES Inc.
Edmund Blackshear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module assembly with patterned adhesive array
Patent number
9,093,563
Issue date
Jul 28, 2015
International Business Machines Corporation
Edmund Blackshear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of optimizing land grid array geometry
Patent number
7,841,078
Issue date
Nov 30, 2010
International Business Machines Corporation
Roger Lam
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inclined solder wave methodology for wave soldering double sided pi...
Patent number
6,974,071
Issue date
Dec 13, 2005
International Business Machines Corporation
Todd H. Buley
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of assembling a land grid array module
Patent number
6,711,810
Issue date
Mar 30, 2004
International Business Machines Corporation
Todd H. Buley
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY
Publication number
20150093859
Publication date
Apr 2, 2015
International Business Machines Corporation
Edmund Blackshear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Module Assembly With Patterned Adhesive Array
Publication number
20150014836
Publication date
Jan 15, 2015
International Business Machines Corporation
Edmund Blackshear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAND GRID ARRAY SITE GEOMETRY FOR ELECTRONIC ASSEMBLIES
Publication number
20090172941
Publication date
Jul 9, 2009
International Business Machines Corporation
Roger Lam
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVI...
Publication number
20050174738
Publication date
Aug 11, 2005
International Business Machines Corporation
Roger Lam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PI...
Publication number
20050061850
Publication date
Mar 24, 2005
International Business Machines Corporation
Todd H. Buley
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of assembling a land grid array module and alignment tool fo...
Publication number
20030051338
Publication date
Mar 20, 2003
International Business Machines Corporation
Todd H. Buley
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...