Roger M. Arbuthnot

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure for gallium nitride devices
- Patent number 11,107,753
- Issue date Aug 31, 2021
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 10,522,448
- Issue date Dec 31, 2019
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,870,986
- Issue date Jan 16, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a lateral device and related methods
- Patent number 9,646,919
- Issue date May 9, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,576,883
- Issue date Feb 21, 2017
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,558,968
- Issue date Jan 31, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,397,028
- Issue date Jul 19, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a lateral device and related methods
- Patent number 9,379,193
- Issue date Jun 28, 2016
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,070,721
- Issue date Jun 30, 2015
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,384,206
- Issue date Feb 26, 2013
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package and structure therefor
- Patent number 7,935,575
- Issue date May 3, 2011
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having multiple heat dissipation pa...
- Patent number 7,495,323
- Issue date Feb 24, 2009
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE FOR GALLIUM NITRIDE DEVICES
- Publication number 20200168529
- Publication date May 28, 2020
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20180096925
- Publication date Apr 5, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20170141017
- Publication date May 18, 2017
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20170110391
- Publication date Apr 20, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20160315032
- Publication date Oct 27, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS
- Publication number 20160276250
- Publication date Sep 22, 2016
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20160079095
- Publication date Mar 17, 2016
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS
- Publication number 20160043189
- Publication date Feb 11, 2016
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20150270196
- Publication date Sep 24, 2015
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20140264806
- Publication date Sep 18, 2014
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110169152
- Publication date Jul 14, 2011
- STEPHEN ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREFOR
- Publication number 20090250794
- Publication date Oct 8, 2009
- STEPHEN ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING MULTIPLE HEAT DISSIPATION PA...
- Publication number 20080054438
- Publication date Mar 6, 2008
- Semiconductor Components Industries, LLC.
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS

Roger M. Arbuthnot

Person

Patents Grantslast 30 patents

Packaging structure for gallium nitride devices

Single or multi chip module package and related methods

Semiconductor devices and methods of making the same

Semiconductor devices and methods of making the same

Single or multi chip module package and related methods

Semiconductor package for a lateral device and related methods

Semiconductor devices and methods of making the same

Single or multi chip module package and related methods

Semiconductor devices and methods of making the same

Semiconductor package for a lateral device and related methods

Semiconductor devices and methods of making the same

Semiconductor package

Method of forming a semiconductor package and structure therefor

Semiconductor package structure having multiple heat dissipation pa...

Patents Applicationslast 30 patents

PACKAGING STRUCTURE FOR GALLIUM NITRIDE DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREFOR

SEMICONDUCTOR PACKAGE STRUCTURE HAVING MULTIPLE HEAT DISSIPATION PA...