Roger Melcher

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Bumps bonds formed as metal line interconnects in a semiconductor d...
- Patent number 9,812,380
- Issue date Nov 7, 2017
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple well drain engineering for HV MOS devices
- Patent number 8,962,397
- Issue date Feb 24, 2015
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOS transistor with improved metal contact
- Patent number 8,937,351
- Issue date Jan 20, 2015
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated bump bonding
- Patent number 8,921,986
- Issue date Dec 30, 2014
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMPS BONDS FORMED AS METAL LINE INTERCONNECTS IN A SEMICONDUCTOR D...
- Publication number 20160013121
- Publication date Jan 14, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Bump Bonding
- Publication number 20140264796
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOS Transistor with Improved Metal Contact
- Publication number 20140246722
- Publication date Sep 4, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WELL DRAIN ENGINEERING FOR HV MOS DEVICES
- Publication number 20130026545
- Publication date Jan 31, 2013
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS