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Roger Paul STOUT
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Chandler, AZ, US
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last 30 patents
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Patent Grant
Substrate structures and methods of manufacture
Patent number
11,437,304
Issue date
Sep 6, 2022
Semiconductor Components Industries, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low thermal resistance semiconductor device and method therefor
Patent number
7,138,315
Issue date
Nov 21, 2006
Semiconductor Components Industries, LLC
Narayan Raja
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a low thermal resistance device and structure
Patent number
7,022,564
Issue date
Apr 4, 2006
Semiconductor Components Industries, LLC
Narayan Raja
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for and methods of die bonding
Patent number
4,876,791
Issue date
Oct 31, 1989
Kulicke and Soffa Industries, Inc.
Gerard H. Michaud
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Apparatus for and methods of die bonding
Patent number
4,797,994
Issue date
Jan 17, 1989
Kulicke and Soffa Industries, Inc.
Gerard H. Michaud
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
Publication number
20220375833
Publication date
Nov 24, 2022
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
Publication number
20210320054
Publication date
Oct 14, 2021
Semiconductor Components Industries, LLC
Hiroshi INOGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
Publication number
20170162481
Publication date
Jun 8, 2017
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low thermal resistance semiconductor device and method therefor
Publication number
20060084228
Publication date
Apr 20, 2006
Semiconductor Components Industries, LLC.
Narayan Raja
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A LOW THERMAL RESISTANCE DEVICE AND STRUCTURE
Publication number
20060084210
Publication date
Apr 20, 2006
Semiconductor Components Industries, LLC.
Narayan Raja
H01 - BASIC ELECTRIC ELEMENTS