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Singapore, SG
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Patents Grants
last 30 patents
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Patent Grant
Flexible sinter tool for bonding semiconductor devices
Patent number
11,676,937
Issue date
Jun 13, 2023
ASMPT SINGAPORE PTE. LTD.
Jiapei Ding
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
Publication number
20220359459
Publication date
Nov 10, 2022
ASM Technology Singapore Pte Ltd
Jiapei DING
H01 - BASIC ELECTRIC ELEMENTS