Roland KOPPERT

Person

Triftern, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,882,565
- Issue date Nov 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the double-side polishing of a semiconductor wafer
- Patent number 8,721,390
- Issue date May 13, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,647,173
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a substrate composed of semiconductor material
- Patent number 8,647,985
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing an epitaxially coated semiconductor wafer
- Patent number 8,551,870
- Issue date Oct 8, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method for polishing a semiconductor wafer
- Patent number 8,444,455
- Issue date May 21, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer with a strained-relaxed...
- Patent number 8,338,302
- Issue date Dec 25, 2012
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20130189904
- Publication date Jul 25, 2013
- Siltronic AG
- Juergen SCHWANDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Pad and Method For Polishing A Semiconductor Wafer
- Publication number 20130157543
- Publication date Jun 20, 2013
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER
- Publication number 20110244762
- Publication date Oct 6, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110244760
- Publication date Oct 6, 2011
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110097974
- Publication date Apr 28, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad and Method For Polishing A Semiconductor Wafer
- Publication number 20100330882
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Producing An Epitaxially Coated Semiconductor Wafer
- Publication number 20100330786
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Polishing A Semiconductor Wafer With A Strained-Relaxed...
- Publication number 20100130012
- Publication date May 27, 2010
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method For Polishing A Substrate Composed Of Semiconductor Material
- Publication number 20090029552
- Publication date Jan 29, 2009
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING

Roland KOPPERT

Person

Patents Grantslast 30 patents

Method for polishing a semiconductor wafer

Method for the double-side polishing of a semiconductor wafer

Method for polishing a semiconductor wafer

Method for polishing a substrate composed of semiconductor material

Method for producing an epitaxially coated semiconductor wafer

Polishing pad and method for polishing a semiconductor wafer

Method for polishing a semiconductor wafer with a strained-relaxed...

Patents Applicationslast 30 patents

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Polishing Pad and Method For Polishing A Semiconductor Wafer

METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Polishing Pad and Method For Polishing A Semiconductor Wafer

Method For Producing An Epitaxially Coated Semiconductor Wafer

Method For Polishing A Semiconductor Wafer With A Strained-Relaxed...

Method For Polishing A Substrate Composed Of Semiconductor Material