Roland Rupp

Person

Lauf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 12,027,591
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor wafer
- Patent number 11,881,406
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,869,840
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of re-using a silicon carbide substrate
- Patent number 11,735,642
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a silicon carbide substrate for an electri...
- Patent number 11,721,547
- Issue date Aug 8, 2023
- Infineon Technologies AG
- Christian Hecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
- Patent number 11,712,749
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 11,715,768
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor composit...
- Patent number 11,515,264
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor wafer
- Patent number 11,417,528
- Issue date Aug 16, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a silicon carbide device and wafer composit...
- Patent number 11,373,863
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,367,683
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trench gate structure and manufactur...
- Patent number 11,251,269
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers and semiconductor devices with barrier layer a...
- Patent number 11,239,384
- Issue date Feb 1, 2022
- INFINEON TECHNOLOGIESAG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a silicon carbide semiconductor device with...
- Patent number 11,195,946
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Andreas Peter Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing silicon carbide semiconductor devices
- Patent number 11,177,354
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,158,557
- Issue date Oct 26, 2021
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor component with edge termination struc...
- Patent number 11,145,755
- Issue date Oct 12, 2021
- Infineon Technologies AG
- Larissa Wehrhahn-Kilian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,139,375
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trench structures and manufacturing...
- Patent number 11,121,220
- Issue date Sep 14, 2021
- Infineon Technologies AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 11,107,893
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer, methods...
- Patent number 11,107,732
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 11,069,778
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor component
- Patent number 11,063,144
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 11,046,577
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Forming semiconductor devices in silicon carbide
- Patent number 11,031,483
- Issue date Jun 8, 2021
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
- Publication number 20230411336
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
- Publication number 20230361196
- Publication date Nov 9, 2023
- Infineon Techmologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Components and Methods for Producing Silicon Carbid...
- Publication number 20230334337
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20230330769
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER
- Publication number 20220367191
- Publication date Nov 17, 2022
- INFINEON TECHNOLOGIES AG
- Francisco Javier SANTOS RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Semiconductor Wafer and Semiconductor Compo...
- Publication number 20220359428
- Publication date Nov 10, 2022
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20220285283
- Publication date Sep 8, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Silicon Carbide Semiconductor Devices
- Publication number 20220028980
- Publication date Jan 27, 2022
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with a Passivation Layer and Method for Produc...
- Publication number 20220005742
- Publication date Jan 6, 2022
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device and a Semiconductor Device
- Publication number 20210359087
- Publication date Nov 18, 2021
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...
- Publication number 20210351077
- Publication date Nov 11, 2021
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Components and Methods for Producing Silicon Carbid...
- Publication number 20210313431
- Publication date Oct 7, 2021
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Re-using a Silicon Carbide Substrate
- Publication number 20210265484
- Publication date Aug 26, 2021
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SILICON CARBIDE SEMICONDUCTOR DEVICE WITH...
- Publication number 20210167203
- Publication date Jun 3, 2021
- Andreas Peter Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20210053148
- Publication date Feb 25, 2021
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER
- Publication number 20200381256
- Publication date Dec 3, 2020
- INFINEON TECHNOLOGIES AG
- Francisco Javier SANTOS RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafers and Semiconductor Devices with Barrier Layer a...
- Publication number 20200365754
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Francisco Javier SANTOS RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Silicon Carbide Device and Wafer Composit...
- Publication number 20200357637
- Publication date Nov 12, 2020
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Edge Shaping of Substrates
- Publication number 20200343085
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20200286730
- Publication date Sep 10, 2020
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...
- Publication number 20200198963
- Publication date Jun 25, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device Including Trench Structures and Manufacturing...
- Publication number 20200176568
- Publication date Jun 4, 2020
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Silicon Carbide Semiconductor Devices
- Publication number 20200152743
- Publication date May 14, 2020
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Trench Gate Structure and Manufactur...
- Publication number 20200098868
- Publication date Mar 26, 2020
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20200013723
- Publication date Jan 9, 2020
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200013859
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Carsten SCHAEFFER
- H01 - BASIC ELECTRIC ELEMENTS

Roland Rupp

Person

Patents Grantslast 30 patents

Method for forming a semiconductor device and a semiconductor device

Method of manufacturing a semiconductor device and semiconductor wafer

Semiconductor device with a porous portion, wafer composite and met...

Silicon carbide device and method for forming a silicon carbide device

Semiconductor device with a passivation layer and method for produc...

Method for processing a semiconductor wafer, semiconductor wafer, c...

Methods of re-using a silicon carbide substrate

Method for manufacturing a silicon carbide substrate for an electri...

Parent substrate, wafer composite and methods of manufacturing crys...

Silicon carbide components and methods for producing silicon carbid...

Method for processing a semiconductor wafer, semiconductor composit...

Semiconductor device with a porous portion, wafer composite and met...

Method of manufacturing a semiconductor device and semiconductor wafer

Semiconductor package devices and method for forming semiconductor...

Method of manufacturing a silicon carbide device and wafer composit...

Silicon carbide device and method for forming a silicon carbide device

Semiconductor device including trench gate structure and manufactur...

Semiconductor wafers and semiconductor devices with barrier layer a...

Method of manufacturing a silicon carbide semiconductor device with...

Method of manufacturing silicon carbide semiconductor devices

Semiconductor device with a passivation layer and method for produc...

Silicon carbide semiconductor component with edge termination struc...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device including trench structures and manufacturing...

Method for forming a semiconductor device and a semiconductor device

Methods for processing a wide band gap semiconductor wafer, methods...

Silicon carbide components and methods for producing silicon carbid...

Silicon carbide semiconductor component

Method for processing a monocrystalline substrate and micromechanic...

Forming semiconductor devices in silicon carbide

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...

Silicon Carbide Components and Methods for Producing Silicon Carbid...

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Method for Processing a Semiconductor Wafer and Semiconductor Compo...

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

Method of Manufacturing Silicon Carbide Semiconductor Devices

Semiconductor Device with a Passivation Layer and Method for Produc...

Method for Forming a Semiconductor Device and a Semiconductor Device

Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...

Silicon Carbide Components and Methods for Producing Silicon Carbid...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

Methods of Re-using a Silicon Carbide Substrate

METHOD OF MANUFACTURING A SILICON CARBIDE SEMICONDUCTOR DEVICE WITH...

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER

Semiconductor Wafers and Semiconductor Devices with Barrier Layer a...

Method of Manufacturing a Silicon Carbide Device and Wafer Composit...

Edge Shaping of Substrates

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...

Semiconductor Device Including Trench Structures and Manufacturing...

Method of Manufacturing Silicon Carbide Semiconductor Devices

Semiconductor Device Including Trench Gate Structure and Manufactur...

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...