Roland SPECKELS

Person

Kamen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-sintered semiconductor die structure
- Patent number 8,835,299
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including diffusion soldered layer on sintered...
- Patent number 8,736,052
- Issue date May 27, 2014
- Infineon Technologies AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for making a semiconductor device including bondi...
- Patent number 8,439,249
- Issue date May 14, 2013
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components on a support
- Patent number 8,209,858
- Issue date Jul 3, 2012
- Infineon Technologies AG
- Roland Speckels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for connecting a component with a substrate
- Patent number 8,104,667
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for producing semiconductor modules
- Patent number 7,851,334
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for connecting a component with a substrate
- Patent number 7,793,819
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip attachment
- Patent number 7,555,832
- Issue date Jul 7, 2009
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for connecting components
- Patent number 7,525,187
- Issue date Apr 28, 2009
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Arrangement and Method for Joining at Least Two Joining Partners
- Publication number 20200294956
- Publication date Sep 17, 2020
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Integral Join and Automatic Placement Machine
- Publication number 20160351533
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Producing a Connecting Medium on an Assembly Partner, Me...
- Publication number 20160225735
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...
- Publication number 20130049204
- Publication date Feb 28, 2013
- INFINEON TECHNOLOGIES AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Connecting a Component With a Substrate
- Publication number 20110017803
- Publication date Jan 27, 2011
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...
- Publication number 20100078463
- Publication date Apr 1, 2010
- INFINEON TECHNOLOGIES AG
- Roland SPECKELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR MODULES
- Publication number 20090023250
- Publication date Jan 22, 2009
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE
- Publication number 20080230589
- Publication date Sep 25, 2008
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Attachment
- Publication number 20080229575
- Publication date Sep 25, 2008
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for connecting components
- Publication number 20080096311
- Publication date Apr 24, 2008
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement For Mounting Electronic Components On A Support
- Publication number 20070175021
- Publication date Aug 2, 2007
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS

Roland SPECKELS

Person

Patents Grantslast 30 patents

Arrangement and method for joining at least two joining partners

Method for producing an integral join and automatic placement machine

Method for producing a connecting medium on an assembly partner, me...

Pre-sintered semiconductor die structure

Semiconductor device including diffusion soldered layer on sintered...

Device and method for making a semiconductor device including bondi...

Method for mounting electronic components on a support

Method for connecting a component with a substrate

Apparatus and method for producing semiconductor modules

Apparatus and method for connecting a component with a substrate

Semiconductor chip attachment

Apparatus and method for connecting components

Patents Applicationslast 30 patents

Arrangement and Method for Joining at Least Two Joining Partners

Method for Producing an Integral Join and Automatic Placement Machine

Method for Producing a Connecting Medium on an Assembly Partner, Me...

Pre-Sintered Semiconductor Die Structure

SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...

Method for Connecting a Component With a Substrate

DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...

APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR MODULES

APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE

Semiconductor Chip Attachment

Apparatus and method for connecting components

Arrangement For Mounting Electronic Components On A Support