Rolf Aschenbrenner

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing contactless chip cards and corresponding conta...
- Patent number 6,651,891
- Issue date Nov 25, 2003
- Smart Pac GmbH Technology Services
- Elke Zakel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact-bumpless chip contacting method and an electronic circuit p...
- Patent number 6,407,457
- Issue date Jun 18, 2002
- Smart Pac GmbH Technology Services
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a structured metallization on a semiconductor wafer
- Patent number 6,284,639
- Issue date Sep 4, 2001
- Fraunhofer-Gesellschaft zur Foerderung der angwandten Forschung e.V.
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,277,660
- Issue date Aug 21, 2001
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,211,571
- Issue date Apr 3, 2001
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Chip-contacting method requiring no contact bumps, and electronic c...
- Patent number 6,107,118
- Issue date Aug 22, 2000
- Zakel; Elke
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for galvanic forming of bonding pads
- Patent number 5,989,993
- Issue date Nov 23, 1999
- Zakel; Elke
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding with non conductive adhesive
- Patent number 5,928,458
- Issue date Jul 27, 1999
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump for flip chip assembly and method of its fabrication
- Patent number 5,906,312
- Issue date May 25, 1999
- Franunhofer-Gesellschaft zur Foerde-rung der angwandten Forschung e.V.
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS

Rolf Aschenbrenner

Person

Patents Grantslast 30 patents

Method for producing contactless chip cards and corresponding conta...

Contact-bumpless chip contacting method and an electronic circuit p...

Method for forming a structured metallization on a semiconductor wafer

Method and apparatus for testing chips

Method and apparatus for testing chips

Chip-contacting method requiring no contact bumps, and electronic c...

Method for galvanic forming of bonding pads

Flip chip bonding with non conductive adhesive

Solder bump for flip chip assembly and method of its fabrication