Roman Roth

Person

Sattendorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a metal adhesion and ba...
- Patent number 10,777,506
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device load terminal
- Patent number 10,756,035
- Issue date Aug 25, 2020
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal adhesion and barrier structure...
- Patent number 10,475,743
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,224,237
- Issue date Mar 5, 2019
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 10,079,217
- Issue date Sep 18, 2018
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a reduced band gap zone
- Patent number 9,859,272
- Issue date Jan 2, 2018
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate layer for copper structuring and methods of formation...
- Patent number 9,773,736
- Issue date Sep 26, 2017
- Infineon Technologies AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a locally reinforced metallization stru...
- Patent number 9,397,022
- Issue date Jul 19, 2016
- Infineon Technologies Austria AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a locally reinforced metallization stru...
- Patent number 9,196,560
- Issue date Nov 24, 2015
- Infineon Technologies Austria AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding connection between a bonding wire and a power semiconductor...
- Patent number 8,541,892
- Issue date Sep 24, 2013
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a power device with first metal laye...
- Patent number 7,851,913
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE
- Publication number 20230317542
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Jochen HILSENBECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING POWER SEMICONDUC...
- Publication number 20230082571
- Publication date Mar 16, 2023
- INFINEON TECHNOLOGIES AG
- Jochen HILSENBECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...
- Publication number 20200013722
- Publication date Jan 9, 2020
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20180366428
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20170345711
- Publication date Nov 30, 2017
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Metal Adhesion and Barrier Structure...
- Publication number 20170271268
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20170221842
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Load Terminal
- Publication number 20170098620
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with a Reduced Band Gap Zone
- Publication number 20170025408
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermediate Layer for Copper Structuring and Methods of Formation...
- Publication number 20160218033
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Locally Reinforced Metallization Stru...
- Publication number 20160043013
- Publication date Feb 11, 2016
- Infineon Technologies Austria AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Locally Reinforced Metallization Stru...
- Publication number 20150115391
- Publication date Apr 30, 2015
- Infineon Technologies Austria AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Connection Between a Bonding Wire and a Power Semiconductor...
- Publication number 20110121458
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Bond
- Publication number 20100212153
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing a semiconductor device
- Publication number 20080122091
- Publication date May 29, 2008
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power semiconductor device load terminal

Silicon carbide semiconductor device having a metal adhesion and ba...

Semiconductor device load terminal

Semiconductor device having a metal adhesion and barrier structure...

Semiconductor devices and methods for forming a semiconductor device

Power semiconductor device load terminal

Semiconductor device with a reduced band gap zone

Intermediate layer for copper structuring and methods of formation...

Semiconductor device having a locally reinforced metallization stru...

Semiconductor device having a locally reinforced metallization stru...

Method for fabricating a bond

Bonding connection between a bonding wire and a power semiconductor...

Semiconductor device including a power device with first metal laye...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE

POWER SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING POWER SEMICONDUC...

Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

Semiconductor Devices and Methods for Forming a Semiconductor Device

Semiconductor Device Having a Metal Adhesion and Barrier Structure...

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

Semiconductor Device Load Terminal

Semiconductor Device with a Reduced Band Gap Zone

Intermediate Layer for Copper Structuring and Methods of Formation...

Semiconductor Device Having a Locally Reinforced Metallization Stru...

Semiconductor Device Having a Locally Reinforced Metallization Stru...

Bonding Connection Between a Bonding Wire and a Power Semiconductor...

Method for Fabricating a Bond

Semiconductor device and method for producing a semiconductor device