Romeo Emmanuel P. Alvarez

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit system having different-size solder bumps and di...
- Patent number 8,487,438
- Issue date Jul 16, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a wafer level chip scale package, and package fo...
- Patent number 6,732,913
- Issue date May 11, 2004
- Advanpack Solutions PTE LTD
- Romeo Emmanuel P. Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a flip chip semiconductor package
- Patent number 6,510,976
- Issue date Jan 28, 2003
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP PAD
- Publication number 20070114639
- Publication date May 24, 2007
- STATS ChipPAC Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with selective underfill and fabrication meth...
- Publication number 20060252177
- Publication date Nov 9, 2006
- STATS ChipPAC Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for solder bumping, and solder-bumping structures produced t...
- Publication number 20060125110
- Publication date Jun 15, 2006
- STATS ChipPAC Ltd.
- Byung Tai Do
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming a wafer level chip scale package, and package fo...
- Publication number 20040198022
- Publication date Oct 7, 2004
- Advanpack Solutions Pte. Ltd.
- Romeo Emmanuel P. Alvarez
- H01 - BASIC ELECTRIC ELEMENTS