Romeo Emmanuel P. Alvarez

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with bump pad
- Patent number 8,008,770
- Issue date Aug 30, 2011
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit solder bumping system
- Patent number 7,566,650
- Issue date Jul 28, 2009
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for solder bumping, and solder-bumping structures produced t...
- Patent number 7,410,824
- Issue date Aug 12, 2008
- Stats Chippac Ltd.
- Byung Tai Do
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with selective underfill and fabrication meth...
- Patent number 7,169,641
- Issue date Jan 30, 2007
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT SOLDER BUMPING SYSTEM
- Publication number 20090250813
- Publication date Oct 8, 2009
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD
- Publication number 20080230925
- Publication date Sep 25, 2008
- Byung Tai Do
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT SOLDER BUMPING SYSTEM
- Publication number 20070069346
- Publication date Mar 29, 2007
- STATS ChipPAC Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a wafer level chip scale package
- Publication number 20040130034
- Publication date Jul 8, 2004
- Advanpack Solutions Pte. Ltd.
- Romeo Emmanuel P. Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a wafer level chip scale package, and package fo...
- Publication number 20030127502
- Publication date Jul 10, 2003
- Romeo Emmanuel P. Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20020170942
- Publication date Nov 21, 2002
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS