Ron Boja

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Gilroy, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Stiffening electronic packages by disposing a stiffener ring betwee...
- Patent number 9,760,132
- Issue date Sep 12, 2017
- NVIDIA Corporation
- Leilei Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Open solder mask and or dielectric to increase lid or ring thicknes...
- Patent number 9,716,051
- Issue date Jul 25, 2017
- NVIDIA Corporation
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Absorbing excess under-fill flow with a solder trench
- Patent number 9,368,422
- Issue date Jun 14, 2016
- NVIDIA Corporation
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENING ELECTRONIC PACKAGES
- Publication number 20150077918
- Publication date Mar 19, 2015
- NVIDIA Corporation
- Leilei Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ABSORBING EXCESS UNDER-FILL FLOW WITH A SOLDER TRENCH
- Publication number 20140175681
- Publication date Jun 26, 2014
- NVIDIA Corporation
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN SOLDER MASK AND OR DIELECTRIC TO INCREASE LID OR RING THICKNES...
- Publication number 20140124913
- Publication date May 8, 2014
- NVIDIA Corporation
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUC...
- Publication number 20140124254
- Publication date May 8, 2014
- NVIDIA Corporation
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS